制备了适用于该涂层技术的金属微粉。
The metal micro-powder suitable for technology of this coating have been prepared.
讨论了成膜树脂、金属微粉、各种添加剂和溶剂等对涂层电磁屏蔽的影响。
The effects of film-forming resins, metallic powder, additives and solvents on the electromagnetic shielding and microstructure of the film were discussed.
讨论了成膜树脂、金属微粉、各种添加剂和溶剂等对涂层电磁屏蔽的影响。
The effects of film-forming resins, metallic powder, additives and solvents on the electromagnetic shielding and microstructure of the film were discussed.
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