介绍表面贴装产品生产的工艺流程。
球形触点陈列，表面贴装型封装之一。
表面贴装元件回流可修复不同衬底材料。
Surface Mount Component Reflow repair on various substrate materials.
体积小，无引线，适合高密度表面贴装。
Miniature size, No lead, ideal for high density SMT installation.
包括横梁、柱子、排水管道、供水管道或表面贴装线。
That can include beams, posts, drain lines, water piping or surface-mounted wires.
用途： 适用于表面贴装的一般放大电路。
Purpose: General purpose amplifier for surface mount applications.
表面贴装型、快速熔断；
表面贴装，钢网是锡膏准确重复印刷的关键。
In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.
对于整个表面贴装领域，都是个棘手的问题。
标准表面贴装技术或通孔技术提供足够的性能。
Standard surface-mount technology or through-hole techniques provide adequate performance.
结构紧凑，重量轻，高击穿电压，表面贴装型。
Compact and lightweight, High breakdown voltage, Surface mounting type.
表面贴装器件封装在磁带和卷轴，便于自动布局。
Surface mount devices are packaged on tape and reel for easy auto placement.
表面贴装LED灯。超级明亮的绿色。镜头类型的水清除。
Surface mount LED lamp. Super bright green. Lens type water clear.
采用波峰焊工艺可能会对先期焊接的表面贴装元件造成损伤。
The wave soldering process may advance welding on the surface mount components damage.
表面贴装LED灯。效率高红，超明亮的绿色。镜头类型，水质清澈。
Surface mount LED lamp. High efficiency red, super bright green. Lens type water clear.
表面贴装开关。厚度0.35毫米4接触。操作力1.96N。大坪。
Surface mountable switch. Thickness 0.35mm 4 contacts. Operating force 1.96n. Taping.
表面贴装开关。厚度0.55毫米2接触。操作力1.18N。绑带。
Surface mountable switch. Thickness 0.55mm 2 contacts. Operating force 1.18n. Taping.
表面贴装开关。厚度0.35毫米4接触。操作力1.18N。大坪。
Surface mountable switch. Thickness 0.35mm 4 contacts. Operating force 1.18n. Taping.
表面贴装开关。厚度0.55毫米4接触。操作力1.18N。大坪。
Surface mountable switch. Thickness 0.55mm 4 contacts. Operating force 1.18n. Taping.
这两款芯片安装在陶瓷基板，然后密封在一个密封的陶瓷表面贴装封装。
The two chips are mounted on a ceramic substrate, and then hermetically sealed in a ceramic surface mount package.
表面贴装开关。厚度0.55毫米4接触。操作力2.35N。散装包装。
Surface mountable switch. Thickness 0.55mm 4 contacts. Operating force 2.35N. Bulk packing.
有时候对天花板的一部分或者整体抹灰是隐藏表面贴装水管、电线的最好办法。
Sometimes furring down part of or the entire ceiling is the best way to bury surface-mounted pipes or wires.
表面贴装电子封装提供抗水，油，灰尘，高温，冲击，振动和整体恶劣环境。
Encapsulated surface mount electronics provide resistance to water, oil, dirt, high temperatures, shock and vibrations and overall harsh environments.
表面贴装开关。厚度0.35毫米4接触。操作力1.96N。散装包装。
Surface mountable switch. Thickness 0.35mm 4 contacts. Operating force 1.96n. Bulk packing.
样机运用了软开关技术、铝基板、表面贴装技术、平面变压器和尖峰抑制器等新技术。
Many new technologies, including soft switching technology, Al substrate, SMT, planar transformer and noise suppressors are applied.
提出了无铅印料的配方及性能要求，说明了无铅印料在倒装芯片与表面贴装中的应用。
The essay separately introduced request, realizing approaches and comparison on the pros and cons in accordance with the MES application in SMT.
表面贴装技术是第四代电子组装技术，片式铝电解电容器是这一技术中不可缺少的元件。
In SMT used as the fourth generation of electronic mounting technology chip aluminium electrolytic capacitors are indispensable components.
表面贴装快速开关整流器。最大反向重复峰值电压200五，最大平均正向电流1.0A。
Surface mount fast switching rectifier. Max repetitive peak reverse voltage 200 V. Max average forward current 1.0 a.
在印制电路板的生产过程中，表面贴装是极为重要的一环，其速度直接影响着生产效率的高低。
In the process of print circuit board (PCB) production, the surface mount is an extremely important step, its speed directly affects the production efficiency.
在印制电路板的生产过程中，表面贴装是极为重要的一环，其速度直接影响着生产效率的高低。
In the process of print circuit board (PCB) production, the surface mount is an extremely important step, its speed directly affects the production efficiency.
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