六大教学模块包括元器件认识、工具仪表使用、电路原理和电路设计、线路板制作、组装和配线、调试和检修。
Teaching module includes six components knowledge, tools, instruments used, circuit principle and circuit design, circuit board production, assembly and wiring, debugging and maintenance.
另外，由于柱状块不熔化，半导体线路板和组装线路板之间的距离不因焊料而变窄。
Moreover, since the columnar bump does not fuse, the distance between a semiconductor board and a packaging board is not be narrowed by solder.
另外，由于柱状块不熔化，半导体线路板和组装线路板之间的距离不因焊料而变窄。
Moreover, since the columnar bump does not fuse, the distance between a semiconductor board and a packaging board is not be narrowed by solder.
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