各种电镀层退镀剂及环保型挂具退镀剂。
All kinds of electric plating coating agents and environmental hang out with retreat plating.
镀铜：打底用，增进电镀层附着能力，及抗蚀能力。
Copper plating, improve electricity with: render coating adhesion ability, and corrosion ability.
评述了这些电镀层对铀及铀合金的防腐蚀性能及保护机理。
The corrosion- resistant performance and mechanisms of these coatings for uranium and uranium alloys were evaluated.
锌基合金电镀层由于具有优良的耐蚀性而受到人们的关注。
Zinc based alloy electrodeposits have been emphasized for their excellent corrosion resistance.
利用酸碱和湿热环境对金属的腐蚀性来测试电镀层的抗腐蚀能力。
The use of acid-base and humid environment on the corrosion of metal plating layer to test the corrosion resistance.
电镀层比热浸层均匀，一般都较薄，从几个微米到几十微米不等。
Electric heat uniform coating, generally all baptized layer with thin, from a few microns to dozens of micron range.
产品如要电焊时请采用毛坯的产品进行作业，避免高温烧坏电镀层。
The product such as to when welding use blank product operation, avoid high temperature burned plating layer.
本文简要介绍锡铈镍合金电镀工艺。本工艺镀液稳定，电镀层质量好。
This text simply introduce the technology for Sn-Ce-Ni alloy electroplating. Plating solution is stable. Coat quality is good.
综述了多层电镀层的结构特点、腐蚀机理、镀层组合形成、分类及应用。
This article describes the structure characteristics, corrosion mechanism, classification and application of functional multilayer electrodeposits.
以硼酸锌玻璃体为基础的高压二极管的电镀层的铅的替代品仍然不切实际。
No practicable substitutes for lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body are available.
本文在分析影响电镀层整平性能因素的基础上，寻求电镀工艺的最优参数。
On the basis of the analysis of those factors that affect the level off performance of electroplating, the optimum parameters of plating process were found in this paper.
帮助企业了解五金配件的电镀层类型对试验周期的影响和耐腐蚀性的要求。
Simultaneously wish that is helpful for enterprises to understand the relative test cycle for different coatings and the requirements of corrosion resistance.
进口工艺真空电镀，保证电镀层在持续高温下，反光率不降低，确保3 - 5年光亮如新。
Imports of technology of vacuum plating, guarantee under the continuous high temperature electroplated layer, reflecting lower rate does not appear to ensure that bright 3-5 years as new.
金属铜与塑料的膨胀系数比较接近，因此，在塑料电镀中常用化学镀铜层作为电镀的导电镀层。
Copper and plastic coefficient of expansion, and, therefore, more close to the plastic used in electroplating electroless copper plating coating layer as conductive.
引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。
The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.
镁合金表面化学转化处理可以提高镁合金耐蚀性并为其后的涂层、电镀层、化学镀层等保护提供良好基底。
Chemical conversion treatment on face of magnesium alloys can improve its corrosion resistance and provide a better base for following painting: electroplating, electroless chemical plating, etc.
本文对多层陶瓷外壳电镀层起泡的成因进行了探讨和分析。在实际工作的基础上，提出了解决起泡应采取的措施。
The reasons of plating layer blister on multilayer ceramic package are analyzed. On the base of practice the resolve methods are indicated.
我们研制的非硅表面微机械工艺采用两次或三次掩模电镀层，聚酰亚胺和光刻胶分别作为底层和第二、第三层的牺牲层。
We developed a non silicon surface micro machining process with two or three mask electroplating layers and using polyimide or photoresist as sacrificial layers.
为了保持基体金属硬度、磁性以及电镀层性能等均不变，将锌铁合金电镀工艺与磷化工艺进行了组合，以提高钢铁件的防护性能。
Holding primary hardness, magnetism and plating properties of matrix, protection performance of steel was improved by combining the Zn - Fe alloy electroplating and phosphating technology.
任何电镀都必须有一个能产生正常镀层的电流密度范围。
Any plating must have a can produce normal coating the current density range.
在测试电镀镀层的焊锡能力。
采用适当的电镀技术诸如阳极化和附加阴极技术可以控制镀层的厚度和范围。
Proper use of special plating techniques, such as conforming anodes and robbers, can control plating thicknesses and runouts.
电流密度：单位电镀面积下所承受的电流，通常电流密度越高膜厚越厚，但是过高时镀层会烧焦粗燥。
Current density: unit under the plating area under current, usually the higher current density film thickness is thicker, but is high coating will scorched thick dry.
以提高电镀金刚石工具性能为目标，研究了稀土对亮镍镀液性能、镀层性能的影响及机理。
The goal is to improve the performance of bright nickel electroplated tools, and to analyze the influence of rare earths on bright nickel plating performance.
光亮电镀：在适当条件下，从镀槽中直接得到具有光泽镀层的电镀。
Light plating: in the right conditions, can be obtained directly from the plating slot have burnish of plating coating.
也就是说，在电镀过程中当晶核的生成速度大于晶核的成长速度时，就能获得结晶细致、排列紧密的镀层。
That is, in electroplating process when the generation of the nucleation speed is greater than the growth of the nucleation rate, it can get meticulous, crystallization of closely spaced coating.
也就是说，在电镀过程中当晶核的生成速度大于晶核的成长速度时，就能获得结晶细致、排列紧密的镀层。
That is, in electroplating process when the generation of the nucleation speed is greater than the growth of the nucleation rate, it can get meticulous, crystallization of closely spaced coating.
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