本文研究了不电镀的钢筋混凝土复合梁的实验。
调整电镀位置，增加搅拌效果。
电镀产能基本可以满足生产需要。
Plating production capacity can basically meet the production demands.
是否进行电镀的先期质量策划？
用于电镀、防腐及分析试剂。
电镀溶液表面张力过大，湿润剂不足。
Plating solution surface tension is too large, wetting agents insufficient.
重新修正电镀位置，注意电流分布线。
The modification electroplating position, pay attention to the current distribution line.
他们管这叫硫化或电镀或者是回火之类。
电镀时间搅拌效果不良。
仍然可以进行电镀、热处理和机加工作业。
Plating, heat treating and machining operations can also be used.
我以为那把茶壶是银的，原来只是电镀的。
连续电镀：用于线、带、板材的大批量电镀。
Continuous plating: used in line with mass, plank, electroplating.
电解也用于将一种金属电镀在另一种金属上。
改善底层电镀品质。
电镀药水搅拌，循环不均或金属补充不及消耗。
Electroplating mixing potions, uneven circulation or metal added less than consumption.
引导和激励电镀部员工，建立更好的工作环境。
Counsel and motivate plating staff towards creating better working environment.
针对每批电镀附着力，是否使用IPC胶带测试？
Is the IPC tape test performed on each lot for plating adhesion?
稳定镀液和镀液的维护是保证电镀质量的必要条件。
Steadying and maintaining plating liquid is the essential condition of the guarantee to electroplate quality.
我们的产品广泛应用于冶炼，化工，电镀，装饰等。
Our products are widely used in Smelting, Chemical industry, Electroplating, Decorating etc.
这两种方法都是在空隙被电解液填满之前对导电构架进行电镀。
In both cases these are electroplated onto the structure before the remaining gaps are filled with liquid electrolyte.
镀铜：打底用，增进电镀层附着能力，及抗蚀能力。
Copper plating, improve electricity with: render coating adhesion ability, and corrosion ability.
铜片，电镀不锈钢，大理石，耐候钢，定做地毯，实木地板。
GRG, Copper plating, Stainless steel, Marble, Weathering steel, Custom carpet, Wood floors.
检查电镀位置是否偏离，若素材严重变形制程无法改善，须停产。
Check whether plating position deviation, if serious material deformation process cannot improve, shall be discontinued.
两种情况下都是这些材料电镀在机构上，然后余下的空隙用液体电解质填充。
In both cases these are electroplated onto the structure before the remaining gaps are filled with liquid electrolyte.
如此一来，相接触的金属是铝和镉，而不会造成严重的电镀氧化。
Thus metals in contact are aluminum and cadmium, and are not subject to serious galvanic attack.
电镀是一种在电镀槽通上电流使金属沉 淀在基体上的电化学过程。
Electroplating is an electrochemical process by which metal is deposited on a substrate by passing a current through the bath.
光亮电镀：在适当条件下，从镀槽中直接得到具有光泽镀层的电镀。
Light plating: in the right conditions, can be obtained directly from the plating slot have burnish of plating coating.
光亮电镀：在适当条件下，从镀槽中直接得到具有光泽镀层的电镀。
Light plating: in the right conditions, can be obtained directly from the plating slot have burnish of plating coating.
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