本研究以计算流体力学的方法，对电子构装产品的明日之星- - -球栅阵列封装方式，来进行详细的热传分析。
In this study, the computational fluid dynamics approach is employed to analyze the heat transfer for ball grid array package that is popular in modern electronic industry.
在大规模集成芯片中以BGA(球栅阵列)封装的IC芯片被广泛使用。
In large scale integrated chip field, the IC of BGA encapsulation was widely used.
为了预测跌落碰撞下球栅阵列(BGA)封装中无铅焊点的失效，采用ABAQUS软件来模拟跌落碰撞过程中焊点的应力分布。
In order to predict failure location of BGA lead-free solder joints under a drop impact, ABAQUS software is used to analysis stress distribution of the solder joints.
为了预测跌落碰撞下球栅阵列(BGA)封装中无铅焊点的失效，采用ABAQUS软件来模拟跌落碰撞过程中焊点的应力分布。
In order to predict failure location of BGA lead-free solder joints under a drop impact, ABAQUS software is used to analysis stress distribution of the solder joints.
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