该激光器采用可伐-玻璃封接和自由电位板电晕预电离技术。
Using the free-potential electrode corona preionization technique, a compact, rugged, stable and reliable device has been achieved.
介绍了金属与玻璃封接工艺的技术要点和操作规范并具体举例说明。
The technical key points and operating criterion of the sealing-connecting of metal and glass were introduced, and some practical examples were also represented.
用硅烷对B-1E型玻璃封接的电子器件管座表面进行了处理改性，大大提高了玻璃表面的电气绝缘性能。
A surface modification has been made by silane for the electronic device base sealed by B-1E glass. The electric insulation performance of the glass surface is well improved.
创造性的采用“螺纹型”玻璃封接孔代替现有的“直柱型”和“台阶型”玻璃封接孔，产品耐压和耐泄漏性能相应提高1倍。
Creative use "thread" type glass sealing hole instead of existing "straight pillar" and "steps" type glass sealing hole, the product compression resistance and leakage performance increase 1 times.
研究了玻璃粉／环氧树脂封接复合材料的制备与性能。
The preparation and properties of superfine glass powder/epoxy resin composites were studied.
对封接金属的表面处理工艺进行了研究，特别是封接金属上的封接玻璃的配方及玻璃厚度进行了研究。
The surface treatment of the sealing metal is researched, especially the dispensation of sealing glass on the metal and the thickness of the sealing glass.
玻璃焊料的选择与相应的工艺参数对封接件质量起着重要作用。
The selections of glass solders and the corresponding technological parameters are important to the quality of the sealing.
不同类型的玻璃-金属封接对金属材料及玻璃的要求将被讨论。
The requirements for different types of glass-to-metal seals to metal and glass were discussed.
介绍低熔点玻璃材料封接工艺，主要包括低熔点玻璃材料的选择、调制、涂覆、加热处理以及玻璃基板的预处理。
The sealing technique of FED is introduced in this papers, which include the selection, mixing and painting of low fusing point glass, the process of heating and pre-process of the flat glass.
磷酸盐在低熔封接玻璃中既作为主要原料也是成核剂及填料。
The phosphate is used not only as the main material of low-melting sealing glass, and also as the nucleating agent and the filler.
本文研究了含铅的硼酸盐封接玻璃和无铅磷酸盐封接玻璃。
In this paper both lead borate sealing glasses and lead free phosphate sealing glasses are studied.
提出了纤维面板、封接玻璃、金属盘三者匹配封接的条件。
The conditions of match sealing. between fibre panel, soldering glass and metal disk have been discussed.
最后探讨了提高玻璃-陶瓷材料封接性能的可能途径。
At last, the possible ways to improve the sealing performance of glass-ceramic material were discussed.
静电键合是片状材料封接的一种重要手段，讨论了玻璃在电场作用下的键合过程。
Electrostatic bonding is an important encapsulating means for the materials at the chip or wafer level. Reactions and bonding between glasses in an electric field were discussed in this paper.
探讨低熔点微晶封接玻璃的技术要求和封接件的匹配封接条件，并给出部分低熔点微晶封接玻璃的性质和典型封接工艺。
This paper discusses the technical requirements mierocrystal sealing lass-ceramics with lower melting point nd the matching sealing conditions of sealed pieces.
该灯属于热辐射光源，主要用于加热和烘干，具体如玻璃制品、金属、电路板的封接、胶片及印刷制品的固化。以及其它产品表面烘干、干燥、加热。
The light is thermal radiation source, mainly used for heating and drying, the specific, such as glass, metal, circuit board sealing, film and printing products for curing.
然而，通常热膨服系数高的封接玻璃软化温度低，而热膨胀系数低的软化温度偏高。
The soldering glass has a rather low coefficient of expansion as well as low sealing temperature.
研究了玻璃粉／环氧树脂封接复合材料的制备与性能。
Preparation and Properties Study on Encapsulating Materials of Epoxy Resin;
研究了玻璃粉／环氧树脂封接复合材料的制备与性能。
Study on Latent Curing Agent of Epoxy Resin Sheeting Molding Compounds;
研究了玻璃粉／环氧树脂封接复合材料的制备与性能。
The Preparation and Property Research of Epoxy Resin Based Electric Electronic Packaging Material;
研究了玻璃粉／环氧树脂封接复合材料的制备与性能。
The Preparation and Property Research of Epoxy Resin Based Electric Electronic Packaging Material;
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