焊盘的谐振输出是系统设计的关键。
所述一个或多个焊盘被用于测试所选器件。
The one or more parts are utilized to test the selected part.
三种不同的焊盘可能需要为同时回流温度略有不同。
The three different solder pads may each require a slightly different temperature for a simultaneous reflow.
网印：在板两面完全涂覆阻焊油墨，包括导通孔、焊盘。
Screen Print: Solder mask coating will cover completely the panel holes, pads and traces, on both sides.
它有焊盘。
有时孔口应偏移，因此，他们不直接正对焊盘中央。
Sometimes aperture openings need to be offset so they are not centered directly over pads.
安装结构的另一面被安装到基板，该基板也具有接合焊盘。
The other side of the mounting structure is mounted to the substrate, which also has bond pads.
本课题的目的在于如何保护湿法腐蚀中芯片的焊盘和结构。
The purpose of this paper is to find ways to protect the pad and the structures on chip during the wet etching.
在产生第一信号缺陷时，使所述信号施加焊盘相互电短接。
When the first signal defect is produced, make the signal-exerting solder pad mutually short-circuit.
在钢网的特定区域，根据孔的密度，有必要只印刷焊盘的一部分。
Depending on the density of the apertures in a particular region of the stencil, it may be necessary to print on only a portion of the pad.
基于同样的原因，限热槽也用于贴片元件内或离元件很近的焊盘。
Themal reliefs are sometimes also used on vias very near, or in, pads of SMT components for the same reason.
放电电路可操作用于将到焊盘的esd脉冲放电至地(203)。
The discharge circuit is operable to discharge the ESD pulse to the pad, to ground (203).
第一管芯，其包括管芯表面和位于所述管芯表面上的管芯接合焊盘；
The die comprises a plurality of die joining bonding pads on the surface of the die.
当封装芯片置于系统中时，还完成将ESD保护装置从输入焊盘断开。
Also to perform disconnection of ESD protection device from input pad once the packaged chip is placed in system.
文章对QFN器件的焊盘设计，网板设计及组装工艺作了详细的介绍。
In this article, bonding pad design, stencil design and assembly process of QFN device will be introduced in detail.
气体等离子技术能够用于在引线键合前清洗焊盘以改进键合强度和成品率。
Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.
该焊盘由具有第二宽度的图案形成，该第二宽度与该线路的第一宽度一致。
The pad is formed of a pattern having a second width corresponding to a first width of the line.
这可以从不同的焊接到焊盘尺寸为最大功率耗散，和灰给定的最小焊盘尺寸。
This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation.
通孔拐角附近是应力应变的集中区，沿界面至焊盘外缘，应力应变逐渐降低。
The stress-strain concentration is detected at the corner of Cu pad, the lower stress for the outer of Cu pad.
由于模型和载荷的对称性，这里取CSP结构中包含一个焊盘的部分进行分析。
As the model and load symmetry here take CSP structure contains a pad part of the analysis.
该牺牲电路基板的焊盘和孔与该电路基板的多余焊料垂直接近地放置(64)。
The pads and vias of the sacrificial circuit substrate are placed (64) in vertical proximity to the excess solder of the circuit substrate.
设计了原位电阻测试电路，分别考察对比了三种焊盘所形成接头的电阻变化率。
To evaluate the bond properties, the circuit of in-situ resistance measurement was designed. The resistance variations of the bonds obtained with the three kinds of pads were measured.
您还必须小心戴头盔和焊盘，因为不小心英寸可以让你受苦了，其余的你的生活。
You must also be careful about wearing helmets and pads because an inch of carelessness can make you suffer for the rest of your life.
在介质涂层上设置电路，后者包括芯片安装焊盘，连接焊盘和连接它们的电路迹线。
Electrical circuitry is disposed on the dielectric coating, said circuitry including chip mounting pads, connection pads and circuit traces connecting the chip mounting pads to the connection pads.
介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。
This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital image Processing and Pattern Recognition.
为了用较小的规模模拟相对较长的金线和较大的焊盘，提出了一种温度场分析的等效方法。
To simulate the long gold wire and large bond pad, an equivalent method was presented in thermal analysis.
需要离开线路板安装的组件在线路板表面利用引脚形状或其它机械支撑来防止焊盘的翘起。
Components required to be mounted off the board are provided with lead forms at the board surface or other mechanical support to prevent lifting of solder land.
钝化层(18)和聚酰亚胺层(22)将最后的互连层(16)和接合焊盘(28)隔开。
Both a passivation layer (18) and a polyimide layer (22) separate the last interconnect layer (16) and the bond pad (28).
通过完成电路中的各功能模块和焊盘的合理放置，对开关电源监控电路的版图进行了优化设计。
The layout design of the switch mode power supply is optimized through arranging function blocks and pads reasonably.
通过完成电路中的各功能模块和焊盘的合理放置，对开关电源监控电路的版图进行了优化设计。
The layout design of the switch mode power supply is optimized through arranging function blocks and pads reasonably.
应用推荐