在叠层的组装工艺中，比如基板- 焊片-芯片，即使有部分表面被盖住了，这种气氛同样有效。
This is also preformed on covered surfaces a stacked assembly : substrate - pre - form - die.
介绍了焊片零件拉伸、冲裁多工位级进模，分析了零件的冲压工艺性，并对模具结构进行了合理的设计。
It introduced drawing, punching progressive dies for solder pieces and analyzed the processing ability of the component for stamping and punching. The structure of the die was designed reasonably.
通过对插座连接焊片结构特点的分析，确定该冲压件的排样方案，设计了一副级进模。介绍了主要工作零件及模具总装结构设计。
Through analysis of structure of the socket weld connection pieces, determined the layout project, designed a progressive die. Introduced the design points of main parts and die structure.
翅片靠机械配合、粘结、软焊、硬焊、焊接或挤压附着在板上。
Fins are attached to the plates by a mechanical fit, gluing, soldering, brazing, welding, or extrusion.
在往焊接接线片上焊导线时必须非常小心。
Care must be exercised in attaching the lead wires to the soldering tabs.
通过该设备可切片成不同规格尺寸的袋双手提条片料，切好可直接拿去车缝，无需再次焊手提条。
It is able to cut double handle fabrics in different shapes and sizes and the finished ones can be directly taken to be stitched without welding the handle strip again.
解决了QD 115定子引出线与接线片和电器产品电源线与接线片不加填充焊料的焊接问题，避免了多股细铜线焊后变硬的现象。
The stator lead wire of QD115 starter and the lug can be welded without flux filled, which avoids the phenomenon of strands of thin wires getting hard after welding.
文章通过试验证明：纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.
我们凭借着每年制造300,000片金刚石锯片的产量的经验，成功研发和制造出焊架及机械，并不断完善。
Depending on the experience of making 300,000 PCS of middle-sized diamond saw blade per year, we are successful to manufacture the Welding machine, as well as other machines, and keeping perfection.
本实用新型公开了一种转鼓式硫磺结片机，它由焊制而成的转鼓、冷却水通道、硫磺液面控制器、排气罩、液硫锅、刮刀组成。
The utility model discloses a rotary drum type sulfur flaker, comprising a drum, a cooling water passage, a sulfur level controller, an air exhausting hood, a liquor sulfur pot and a shaver welded.
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
广泛用于电解片铜合金钢青铜生铁铜件之焊补。
Widely used in electrolytic copper alloy steel cast bronze pieces of copper pieces of weld-repair.
广泛用于电解片铜合金钢青铜生铁铜件之焊补。
Widely used in electrolytic copper alloy steel cast bronze pieces of copper pieces of weld-repair.
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