残留物少，焊点光泽，干净。
因此，有必要对这种混合焊点进行可靠性分析。
Therefore, it is necessary to study the reliability of this mixed solder joint.
软铅焊使轻钢件、铜件或黄铜件的焊点非常好。
Soldering gives a satisfactory joint for light articles of steel, copper or brass.
切割过程中，有效减少应力发生，防止焊点崩裂；
To avoid welding spot cracking and decreasing physical strength during cutting process.
研究了电极端部形状对焊点产生裂纹及粘结的影响。
The effect of the shape of electrode tip on crack formation and sticking were investigated.
这一结果对于焊点几何形态的设计及优化具有指导意义。
The results are of importance to design and optimize of geometry shape of the solder joint.
钎料凸台和互连焊点的重熔是面阵封装的关键技术之一。
The manufacture of solder bump is one of the key technologies for area array packaging (AAP).
试验结果表明，焊点强度满足要求，熔核尺寸符合要求。
The results show the strength and the dimension of spot meet the requirements.
回流后在芯片下方形成焊点的位置表明，目检是不可能的。
However, the position of the solder joints formed (underneath the chip) after reflow means that visual inspection is impossible.
正因为如此，各部分应该是优良的品质和所有焊点必须紧绌。
Because of this, all parts should be of excellent quality and all solder joints must be tight.
进而分析了点焊镀锌板的电极磨损对压痕深度与焊点质量的影响。
The effect of electrode wear on indentation depth and weld quality was studied for welding galvanization steels.
导线在接插件焊杯内的焊点和导线在印制板上的焊点的焊接质量。
The welding quality of the solder joint on the conducting wire connected with the soldering cover and the PCB.
焊点疲劳寿命通常是通过电子组件进行温度循环加速试验来确定。
Solder joint fatigue life is generally ascertained through accelerated temperature cycle test on electrical subassembly.
裂纹的产生导致了两种焊点强度的降低，对其电性能的影响却甚微。
Furthermore, the formation of cracks results in the degradation of solder joint strength, but affects mildly to the electrical properties.
电脑控制焊点位置与能量，设备调试时间短，易切换，生产效率高。
The computer control the welding spot position and power, Quick change, Run stability.
通过基于以能量为基础的疲劳寿命预测公式预测焊点的失效循环数。
Number of failure cycles is calculated depending on fatigue life prediction equation based on the energy analysis.
共晶钎料BGA球焊点的抗剪强度比锡铅合金钎料自身的抗剪强度大。
The shear strength of BGA joint with eutectic solder is higher than that of tin-lead alloy itself.
提升工作效率80%。可耐高温。不锈钢所有焊点均做亮光处理，美观漂亮。
Raise work efficiency of 80%. High temperature resistance. All stainless steel Solder joints are light treated, beautiful appearance.
在焊点形成的过程中，点焊电流有效值的检测与控制是保证焊接质量的关键。
During the course of forming the welding spot, checking and controlling spot welding current value is the key to assure the welding quality.
但这狂野的小孩勇敢地以一种流体质除去了他，成功地生产了一座无焊点的建筑。
But the wild child boldly gets rid of him with a fluid shield and has yielded a building without welds.
根据焊点及元器件的边缘确定焊点区域及元器件区域，采用面积法二次检测假焊；
Pseudo solder joints were inspected firstly by the center of gravity method after positioning the solder joints and its components.
但焊缝质量受激光对中点和点焊点的影响很大，应尽量避免采用激光对中及点焊。
Besides, centering and tack welding by laser beam should be avoided as centering point and tack-welding point can influence weld quality largely.
通过非线性有限元分析，计算出焊点疲劳寿命对下部填充料基本热力学性质的依赖关系。
Through non-linear finite analysis , the dependence of fatigue life of solder joint on thermomechanical properties of underfill was calculated.
随着微电子封装焊点尺寸的微型化，微连接尺寸效应对焊点的本构方程产生不可忽视的影响。
With the downsizing of solder joints in microelectronic packaging, size effect in micro-joining plays an more important role in the constitutive equation of the solder joints.
分析发现，与无缺陷焊点相比，气孔使焊点中应力应变分布发生了改变，使焊点疲劳寿命缩短；
The effect of gas hole location on SMT solder joint fatigue life has been analyzed by finite element method .
桥架及其支架等安装完毕后，对焊点和支架要进行防腐处理，并喷涂一层和桥架本色相同的面漆。
After the erection of cable tray and the supports, the welding points and supports should be painted, and the final paint for them should be of the color to the self-color of the tray.
桥架及其支架等安装完毕后，对焊点和支架要进行防腐处理，并喷涂一层和桥架本色相同的面漆。
After the erection of cable tray and the supports, the welding points and supports should be painted, and the final paint for them should be of the color to the self-color of the tray.
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