通过对不同工艺参数下形成的混合焊点和无铅焊点进行了外观检测、X射线检测和温度循环测试。
Through appearance testing, X-Ray testing and temperature cycling testing, the reliability of mixed solder joints and lead-free solder joints which formed under various process parameters was assesed.
试验研究了摩托车在EUIII测试循环工况下的排气温度变化，以及对于两种氧传感器起燃时间、陶瓷体温度变化、动态响应特性和排放的影响。
The exhaust gas temperatures rise and variation during EUIII test cycle and its impact on the light-off time, ceramic temperature, dynamic response behavior and emission results were studied.
传感器受到温度循环以及供电单车，加上震动和振动测试在应用情况的需求。
RDP transducers are subjected to temperature cycling as well as electrical supply cycling, plus shock and vibration testing where application circumstances demand. RDP.
提出了一种避开瞬态温度场测试而通过残余应力计算得到最大应力应变循环的方法。
In order to avoid the difficulty and expensive measurement of transient temperature field, a method for maximal stress and strain cycle calculation using residue stress is proposed.
热循环曲线的形状、不封闭程度同增强体的种类、测试方向、热循环温度区间以及热循环次数等因素有关。
The curve shape and close extent of thermal circling are related to rein-forcernents , sarnple orientation , thermal circling number of times and temperature range.
如果空气循环正常，该温度传感器测试的范围可以覆盖900平方英尺的面积。
If air circulation is normal, the TS-1 sensor will cover an area of 900 square feet.
如果空气循环正常，该温度传感器测试的范围可以覆盖900平方英尺的面积。
If air circulation is normal, the TS-1 sensor will cover an area of 900 square feet.
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