适应再流焊和波峰焊。
适应再流焊与波峰焊。
概述了元件安装机的最新技术动向和无通风管道再流焊炉绿色技术。
This paper describes newly technology trend of component mounter and green technology of ductless reflow furnance.
以波峰焊工艺焊点强度为标准，研究在不同钎料量下通孔再流焊焊点的强度。
This study benchmarked the strength of solder joints formed through the Through - Hole Reflow process against the traditional wave soldered joint.
在再流焊无铅化过程中，再流焊的有铅要素与无铅要素的兼容性直接影响产品质量。
In the course of the lead free reflow soldering, lead and lead free of reflow soldering affect the quality of product.
此外，利用有限元ansys软件对PC B组件在整个红外再流焊炉中的焊接过程建立了实体模型，进行了PC B组件再流焊全过程的三维动态模拟和仿真。
Furthermore, the soldering process of PCBA in the whole infrared reflow soldering stove is modeled by the finite element software, ANSYS, and is simulated by the three-dimensional modelling.
焊接工艺评定记录单上应包括封底焊时所用的惰性保护气体组成成分和流率。
The PQR shall include the composition and flow rate of the shielding and inert gas backing, when used.
在加工过程中与原配方比较，料流稳定，提高了制品的光泽度、柔韧性及焊角强度。
Campared with the original composition, the new composition system has more steady flowing, better article glossiness and flexibility, and higher fillet weld strength.
统计分析了焊接缺陷主要是表现为锡球断路、焊锡过流、锡球分布不对称以及烧焦和锡溅，主要受锡球大小、焊盘相对位置以及有关加工参数的影响。
By statistical analysis, the defects are tin-ball short, overflowing, dissymmetry, splash and scorch, which are mainly affected by the tin-ball size, pad positions, and process parameters .
模具设计：选用小的脱模角度减少粘焊，避免尖角应力造成开裂，优化流道设计减少冲蚀…更多。
Design: adopt small draft Angle to reduce soldering, avoid sharp corner to reduce crack, optimize runner system to reduce erosion.
它能提供多种高性能的焊接模式，如恒压埋弧焊、恒流埋弧焊、气保焊、碳弧气刨。
It can provide several high performance welding modes, such as constant-voltage submerged arc welding, constant-current submerged arc welding, gas shielded welding and carbon arc air gouging.
它能提供多种高性能的焊接模式，如恒压埋弧焊、恒流埋弧焊、气保焊、碳弧气刨。
It can provide several high performance welding modes, such as constant-voltage submerged arc welding, constant-current submerged arc welding, gas shielded welding and carbon arc air gouging.
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