以环氧树脂为基体，间苯二胺和氨基二苯甲烷的低融点混合物为固化剂，铜粉为导电填料，制备了热固化各向同性导电胶。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture ofm-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the con-ducting filler.
以环氧树脂为基体，间苯二胺和二氨基二苯甲烷的低融点混合物为固化剂，铜粉为导电填料，制备了热固化各向同性导电胶。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture ofm-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
由邻甲苯胺和甲醛水溶液反应合成得到了高纯度的3，3 -二甲基-4，4 -二氨基二苯甲烷（MDT），并对其性能进行了表征。
The polyimide monomer of 3,3 -dimethyl-4,4 -diaminodiphenylmethane(MDT)was synthesized through the reaction between O-methyl aniline and aqueous formaldehyde solution.
本文报道了利用差示扫描量热仪（DSC）跟踪4，4’-二氨基二苯甲烷四缩水甘油基环氧树脂（TGDDM）与4，4’-二氨基二苯甲烷（DDM）固化体系的固化反应研究的结果。
Studies on the cure reaction of tetraglycidyl 4 , 4'-diaminodiphenyl methane (TGDDM) epoxy with 4, 4'-diaminodiphenyl methane (DDM) has been made by using differential scanning calorimetry (DSC).
本文报道了利用差示扫描量热仪（DSC）跟踪4，4’-二氨基二苯甲烷四缩水甘油基环氧树脂（TGDDM）与4，4’-二氨基二苯甲烷（DDM）固化体系的固化反应研究的结果。
Studies on the cure reaction of tetraglycidyl 4 , 4'-diaminodiphenyl methane (TGDDM) epoxy with 4, 4'-diaminodiphenyl methane (DDM) has been made by using differential scanning calorimetry (DSC).
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