磷化铟晶片在出产线上经过一种称为光刻胶的浆状化学物质进行包裹。
The material of oar shape chemistry that phosphor turns indium chip to call photoetching glue through a kind on product line has package.
介绍投影光刻机设备的晶片传输系统中切边探测和晶片预对准技术。
Mostly introduction the of detection and the of prealignment technology of the Wafer Loader system in the Projection-Lithography equipment.
在紫外光照射穿透的地方，光刻胶的化学特性会被削弱，使硅晶片表面留下图案。
Where the UV light shines through, it chemically weakens the photoresist, leaving a pattern on the surface of the silicon.
接着，硅晶片会被送入一个化学浴室，在暴露在外的硅衬底上蚀刻沟槽，同时光刻胶覆盖的区域不会受到任何影响。
Then the wafer is sent through a chemical bath that etches trenches into the exposed substrate, while leaving the areas covered by the photoresist untouched.
接着，硅晶片会被送入一个化学浴室，在暴露在外的硅衬底上蚀刻沟槽，同时光刻胶覆盖的区域不会受到任何影响。
Then the wafer is sent through a chemical bath that etches trenches into the exposed substrate, while leaving the areas covered by the photoresist untouched.
应用推荐