因此晶圆代工厂的增加是信息时代的熔炉。
Hence the rise of "foundries", the smelters of the information age.
划伤-晶圆片表面上的小皱造成的缺陷。
Slip - A defect pattern of small ridges found on the surface of the wafer.
凹槽-晶圆片边缘上用于晶向定位的小凹槽。
Notch hAn indent on the edge of a wafer used for orientation purposes.
现代洁净室中的所有机器都是用来制造300毫米硅晶圆的。
Every machine in a modern clean room is built around 300-mm wafers.
测试晶圆片駦-用于生产中监测和测试的晶圆片。
Test wafer - a silicon wafer that is used in manufacturing for monitoring and testing purposes.
加工测试晶圆片䏐-用于区域清洁过程中的晶圆片。
Processs Test wafer - a wafer that can be used for processes as well as area cleanliness.
耗尽层-晶圆片上的电场区域，此区域排除载流子。
Depletion Layer - a region on a wafer that contains an electrical field that sweeps out charge carriers.
表面形貌剂-一种用来测量晶圆片表面形貌的工具。
Profilometer - a tool that is used for measuring surface topography.
伊智公司在晶圆探针台领域已经有超过40的年历史了。
Electroglas has been in wafer prober business for over 40 years.
蚀刻-通过化学反应或物理方法去除晶圆片的多余物质。
Etch - a process of chemical reactions or physical removal to rid the wafer of excess materials.
质量保证区（FQA）-晶圆片表面中央的大部分。
Fixed Quality Area (FQA) - The area that is most central on a wafer surface.
研究人员目前正在扩展他们的工作，将单层石墨烯迁移到硅晶圆片上。
The researchers are now extending their work to single graphene sheets that have been transferred onto silicon wafers.
底部硅层ꢃ-在绝缘层下部的晶圆片，是顶部硅层的基础。
Base silicon layer - the silicon wafer that is located underneath the insulator layer, which supports the silicon film on top of the wafer.
从1985年天朗遗弃在交叉印刷电路板的设计和晶圆开关。
From 1985 Tannoy abandoned printed circuit boards and wafer switches in the crossover designs.
在晶圆形式可靠度分析中，承载晶圆的探针台是不可或缺的。
The prober is necessary role in wafer-level analysis of reliability.
原始测试晶圆片㠰-还没有用于生产或其他流程中的晶圆片。
Virgin test wafer - a wafer that has not been used in manufacturing or other processes.
晶圆片搀杂剂可以在元素周期表的III和V族元素中发现。
Dopants for silicon wafers are found in Groups III and V of the Periodic Table of the Elements.
它提供了全面的半导体晶圆制造服务、技术供应商和系统公司。
It provides comprehensive wafer fabrication services and technologies to semiconductor supplier and system companies.
雾度-晶圆片表面大量的缺陷，常常表现为晶圆片表面呈雾状。
Haze - a mass concentration of surface imperfections, often giving a hazy appearance to the wafer.
已经设计出专门的探头来测量半导体晶圆片和半导体棒的电阻率。
Special probes have been designed for making resistivity measurements on semiconductor wafers and bars.
表面起伏ꊝ-在合适的光线下通过肉眼可以发现的晶圆片表面凹陷。
Dimple eA concave depression found on the surface of a wafer that is visible to the eye under the correct lighting conditions.
新工厂将继续在300mm晶圆上利用65nm制程生产Cell处理器等。
The new company will continue producing semiconductors on a 300 mm wafer line and use a 65nm production process.
半导体公司于2000年初期就开始从200mm晶圆转换到300mm技术。
ffAustin (TX) - Semiconductor companies began making the switch from 200mm to 300m wafers in the early 2000s. The push is now on toward 450mm by 2012.
Endura平台是一种模块化的可配置系统，用来在晶圆上沉积金属和金属合金。
The Endura platform is a modular, configurable system used to deposit metals and metal alloys on the wafer.
这些被蚀刻在标准硅晶圆中的渠道直径大约有50微米(一根头发丝的直径)。
These channels, which have a diameter of 50 microns (about the width of a human hair) are etched using standard silicon fabrication.
而建一座高度自动化的、可以用太阳能晶圆制造太阳能电池的工厂则需六个月至一年时间。
It takes six months to a year to build a highly automated factory to make solar cells from solar wafers.
总而言之，我们很高兴成为成长中的中国电子市场的领先模拟晶圆专工厂之一。
In summary, we are pleased to be one of the leading analog foundries for the growing China electronics market.
相比之下，IBM将石墨烯晶体管植入矽-碳晶圆上，然后涂上绝缘层以防止晶体管短路。
By contrast, IBM grew its graphene transistors on a silicon-carbide wafer, and then added an insulating layer which prevents short circuits in the transistors.
过去几十年，随着晶圆尺寸的不断增加，芯片制造商们可以利用单片晶圆上制造出更多的芯片。
Over the past several decades, the wafers upon which chips are made have steadily increased in size, enabling manufacturers to cram more chips on each disk.
LCTI - M的目标是开发一种晶圆级制造流程，这将使热成像仪普及应用到美军每一名士兵。
The goal of LCTI-M is to develop a wafer scale manufacturing process that will make thermal imagers affordable and accessible to every warfighter.
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