每个艺术花盆都是定制的。它们由手工制作的玻璃和无铅焊料接合而成，交付使用时，万事俱备，只欠花卉。
Each sculptural planter is made-to-order with handmade glass and lead-free solder and comes with everything you need but the plants.
对预热温度、焊料槽温度和焊剂体积进行优化后，还可将传送带速度降低，以适应使用无铅焊料时的熔湿速度。
Having optimized preheat temperatures, solder pot temperatures, and flux volume, the conveyor speed may have to be reduced to accommodate the solder wetting when using lead-free solder.
笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述；
Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.
利用这种结构的焊料，我们成功地组装出单条无铝线阵脉冲功率100W的线阵，无铝叠阵脉冲功率为600W。
Utilizing this kind of solder, we have assembled laser arrays with single-bar pulse power of 100W and stacks with pulse power of 600W each.
随后得出了不同焊料在此模型中的适用性及无铅工艺对焊点可靠度的部分影响。
Then which solder is best fit for this model and the influence on fatigue of solder are known, when free-lead solder is used.
在无铅化进程中，由于无铅焊点焊料的不同和焊接工艺参数的调整，必然会给焊点可靠性带来许多新的影响。
In the process of lead-free, because of the difference of lead-free solders and adjustment of technical parameter, we will face many new problems of reliability.
文章以日本为例，介绍低温无铅焊料的技术课题与开发方向。
This article take Japan as an example, introduce technical topic and development direction of low temperature lead-free solder.
这项研究的主要目标之一是建立一个通用的热机械为无铅焊料的耐久性模型。
One of the main objectives of this study is to develop a generic thermo-mechanical durability model for Pb-free solders.
一般来说，相同的焊剂用于无铅焊料是有效的。
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
文中介绍了三种典型无铅焊料体系的不足之处，以及银导电胶研究中的三个难题。
The disadvantages of three typical lead-free solders, and three problems in the conductive adhesive study are discussed.
随着无铅化电子组装需求的日益迫切，人们也越来越关注无铅焊料合金成分的专利问题。
With the increasing requirement of Lead-free electronics assembly, the patent problem on the alloy composition of Pb-free solders has also been greatly concerned.
无铅焊料和助焊剂的特性决定了无铅波峰焊设备在结构和材料选用上有很大不同。
Structures and materials used in lead-free wave soldering equipments were different from traditional wave soldering equipments due to characteristic of lead-free solders and fluxes.
近年来人们已对无钎焊料进行了广泛的研究。
Recently, numerous studies have been published on lead-free solders.
进入21世纪，由于环境保护的要求，锡铅焊料将逐步被无铅焊料所取代。
Due to the consideration of environmental protection, the substitution of lead-containing solder with lead-free solder has become an inevitable trend in the 21st century.
包括背景，焊料，表面镀层，元器件，基板，组装工艺，返工和无铅焊接的可靠性。
It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead-free soldering.
在电子封装中焊料是主要的连接材料，现在无铅焊料已经普及并大规模应用在实际电子产品中。
Solders are the main join materials in the electronic - packaging and now lead-free solders are used in the electrical products on a large scale.
文章通过试验证明：纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.
该装置(1)可使溶出于包含以锡作为主成分的无铅焊料中的铜作为金属间化合物析出以分离铜。
The apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper.
铅和无铅焊料的使用取决于敏捷的产品的具体文件提出的要求是可以接受的。
The use of both lead and lead free solder is acceptable depending on the requirements set forth in the product specific documentation available in Agile.
采用剖样实验和染色实验对无铅焊料微互连的失效机理进行分析。
The cross-section test and dye&pry test are adopted to study the failure mechanism of CSP lead-free solder interconnection.
本发明无铅高温焊料的优点为：熔点较高、机械性能好、焊接缺陷少、焊接可靠性高。
The lead free high temperature solder has the advantages of higher melting point, good mechanical property, less welding defect and high welding reliability.
氮气循环使用，增加无铅焊料的侵润性和流动性，使锡点饱满光亮。
Circulated nitrogen system is designed to improve the wettability and fluidness of lead-free solder and to ensure that the solder joints are shiny and bright.
焊料的无铅化，在国内外电子、信息等领域已成为必然趋势。
It has become an inevitable trend at home and abroad that lead-free solders were used in electronics, information and other fields.
在熔融状态下无铅焊料合金的行为是影响电子产品微连接钎焊性的关键因素。
The solderability of electronic solders and some factors that influence the solderability are discussed.
研究了X含量对新型无铅焊料的导电性、导热性、熔锡速度和干燥度等物理性能的影响。
The effects of X content on the conductivity, thermal conductivity, tin melting rate, dryness, and other physical properties of the new lead-free solder were studied.
研究了X含量对新型无铅焊料的导电性、导热性、熔锡速度和干燥度等物理性能的影响。
The effects of X content on the conductivity, thermal conductivity, tin melting rate, dryness, and other physical properties of the new lead-free solder were studied.
应用推荐