金钢护栏采用无焊组装式的设计，安装快捷简单。
Jingang guardrails adopt the solderless combined type of design which can be installed quickly and easily.
无焊连接。第1部分：无焊绕接。一般要求试验方法和使用指南。
Solderless connections - part 1: wrapped connections - general requirements, test methods and practical guidance.
非晶体金属焊接工艺新颖，焊接接头表面光滑、内外无焊瘤、抗晶间腐蚀性能良好。
The joints welded by newly developed non-crystal metal welding process have smooth surfaces, with excellent intercrystalline corrosion resistance and no internal and external welding beadings.
在塞焊焊缝处及塞焊周围距离内无细漆碎屑存在。
No spalled paint exists at the plug weld and for a short distance each side of the plug welds.
在再流焊无铅化过程中，再流焊的有铅要素与无铅要素的兼容性直接影响产品质量。
In the course of the lead free reflow soldering, lead and lead free of reflow soldering affect the quality of product.
兴中原公司是东南亚地区最具经验与实力的无铅波峰焊制造商之一。
Central Plains region is the most experience and strength of the manufacturers of lead-free wave soldering.
重点论述了前向兼容与后向兼容、锡须、空洞与微空洞、可焊性涂层以及如何避免无铅转移中出现的问题。
The forward compatibility backward compatibility tin whisker voids micro-voids and surface finishes were emphasized and how to avoid the lead free transfer problems were reviewed.
介绍了一种防止磨损轴在焊补过程中出现残余变形，以保证修复轴正常运转的轴磨损无变形焊补工艺。
The article introduces a repair welding technology which prevents the worn axis from residual deformation and assures the repaired axis normally running.
概述了元件安装机的最新技术动向和无通风管道再流焊炉绿色技术。
This paper describes newly technology trend of component mounter and green technology of ductless reflow furnance.
标准泵为离心式，或根据温度设定功率。极端温度下可使用磁力泵和无封焊水泵。
Standard pump designs are centrifugal type rated for the temperature range. For extreme temperatures, magnetic or seal-less pumps are employed.
该焊机采用“无源引弧器”引弧，引入CMOS、时基、大功率开关等集成电路进行弧焊自动控制。
Welding machine control unit is equiped with no power source arc start unit, CMOS, and high power switch.
无铅焊料和助焊剂的特性决定了无铅波峰焊设备在结构和材料选用上有很大不同。
Structures and materials used in lead-free wave soldering equipments were different from traditional wave soldering equipments due to characteristic of lead-free solders and fluxes.
最明显的是，使用无铅锡膏必须提高回流焊温度。
The most obvious is the necessity for increased reflow temperature.
其中无铅波峰焊、无铅回流焊经过几年研究开发，目前已达到国际先进水平。
Which lead-free wave soldering , lead-free reflow after several years of research and development, has now reached international advanced level.
采用合理的焊前表面处理工艺、全熔透焊接可获得无气孔的焊缝。
The weld can performed free of porosity for full penetration weld when proper surface treatment processing prior to welding is employed.
为此，我公司在提供全新高低端无铅波峰焊的同时。
To this end, I provide a new high in low-end lead-free wave soldering at the same time.
概述了低熔点和高熔点型无铅焊膏的开发动向。
This paper describes the development trend of low melting point and high melting point type Lead-free solder paste.
因此，电沉积无铅可焊性镀层是电子电镀领域的研究热点之一。
Therefore, electroplating of lead-free solder coating is one of investigation hotspots in electronic electroplating field.
本公司生产的有铅锡膏已采用符合无铅要求的助焊膏。
Soldering flux meeting the lead-free requirements is used for the lead-containing solder paste manufactured by our company.
适量的表面活性剂的加入，有助于增强无铅焊膏用松香型助焊剂的助焊性能；
The result is that the rosin kind has no effect on soldering ability of rosin-based flux.
实验结果表明，松香种类不影响无铅焊膏用松香型助焊剂的助焊性能。
The factors affecting soldering ability of rosin-based flux for lead-free solder paste, and the factors affecting erosion resistance are discussed.
文章通过试验证明：纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.
无铅波峰焊，波峰焊，波峰焊接机，回流焊。
Lead-free wave soldering, wave soldering, wave soldering machines, reflow.
该镀层的可焊性优良，可作为印刷电路板和元器件的表面镀层，从而实现电子封装的无铅化。
The coating has excellent solder properties and can be used on the surfaces of printed circuit board and patch-like electronic apparatus in order to carry out lead-free electronic packing.
用此工艺焊补铸件，焊补区域与基体间没有明显的熔合线，无渣孔、气孔等缺陷。
By using this process to repair castings, there is no obvious separating line, no slag inclusion and gas hole between the welding zone and base metal.
随着电子产品制造寻求使电子互连无铅很多人都在找纯锡焊和涂层作为一个经济的替代传统的锡铅合金。
As electronics manufacture seek to make electronic interconnectio lead-free, many are looking at pure tin soldering and coating as an economical alternative to traditional tin-lead alloys.
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
波峰焊，符合无铅焊接。
可焊性：根据无铅焊接概况。
可焊性：根据无铅焊接概况。
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