控键会被压缩进这些角落中，不至于影响在屏幕中央的战斗区域。
The controls felt right pressed into these corners so as not to obscure the center combat area of the screen.
基于许多游戏系统的不同控键，我们花了心血设计出了一个合理的布局。
As the different controls for various game systems came together we took the time to develop a logical layout for these.
我们希望尽可能地完全利用起界面的屏幕空间放置指示器和控键，只留下必须的框架数量。
We wanted to utilize almost all of the interface's screen space for indicators and controls, leaving only the necessary amount of framing.
没错，在理想化的条件下：面对有着许多可选项的对话框、菜单或启动页面时，触控快过方向键。
And yes, under ideal conditions, touch is faster than a d-pad when there are lots of options available in a dialog or menu or launcher page.
抱歉啦，诺基亚，苹果等，你们的触控反馈完全比不上物理操作和字母键。
Sorry, Nokia, Apple and so on, haptic feedback doesn't hold a candle to physical control and character entry keys.
例如，大多数多点触控屏幕的iPhone应用程序都将导航键放在屏幕顶部或底部，而在nano上却没有这样充裕的空间。
For example, whereas most multi-screen iPhone apps feature navigation buttons at the top or bottom of the screen, there's no room for such niceties on the nano.
键合是微流控芯片制作的关键技术之一。
Bonding is one of key processes for fabrication of microfluidic chip.
塑料微流控芯片热压键合设备已经投入自动化生产，生产的芯片质量、精度、重复性和一致性良好。
The hot embossing and bonding machines have been used practically in microfluidic chip automatic fabrication, and the chips have satisfactory quality, precision, repetition and consistency.
最后，采用室温键合技术，将带有微纳结构的基片与盖片封合成玻璃微-纳流控复合芯片。
Finally, the channel-structured glass substrate was sealed to a cover glass plate by using room temperature bonding technique.
在微流控芯片的制造过程中，键合是关键步骤之一。
During its fabrication process, bonding is the key procedure to almost all microfluidic chips.
采用光刻法和剥离法进行了阵列电极的制作，并成功键合了带有阵列电极的PD MS -玻璃混合微流控芯片。
The array electrodes were produced by method of photolithography and stripping. and a PDMS-glass microfluidic chip integrating the array of electrodes was bonded efficiently.
对键合成功的PDMS芯片强度进行测试，结果显示：PD MS混合微流控芯片大于0.82MPa，全pdms微流控芯片的键合强度约为0.21 MPa。
Bonding strength testing results showed that: the strength of PDMS mixture microfluidic chip was greater than 0.82mpa and the strength of the whole PDMS microfluidic chip was about 0.21mpa.
对键合成功的PDMS芯片强度进行测试，结果显示：PD MS混合微流控芯片大于0.82MPa，全pdms微流控芯片的键合强度约为0.21 MPa。
Bonding strength testing results showed that: the strength of PDMS mixture microfluidic chip was greater than 0.82mpa and the strength of the whole PDMS microfluidic chip was about 0.21mpa.
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