供应商是否有能力提供高密度互连和微盲孔板的制造能力？
Does supplier have the ability to develop HDI or Microvia process?
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
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