更精细的刻蚀技术可以孕育更高性能的微芯片，而这仅仅是开始。
Finer etching begets higher-performing microchips, and that's just a start.
通过反应离子刻蚀可以将光刻胶微透镜图形转移至这种高性能的聚合物材料上。
Pattern transfer technique is used to transfer photoresist microlens arrays into the polymer underlayer.
利用反应离子束刻蚀等微纳超精细加工而成的多层电介质结构反射镜可在高功率条件下实现啁啾脉冲的光谱整形。
The multilayer dielectric thin film reflector fabricated by top-down nano-fabrication processes can be used to realize the spectral reshaping of high power chirped pulses.
通过对光刻工艺过程的研究，可为较好地控制正性光刻胶面形，制作微机械、微光学器件提供了参考依据，对微浮雕结构的深刻蚀具有重要的指导意义。
We can better control the positive photoresist figure, provide a reference for making MEMS and MOEMS, it is of an important instructional significance for deep relief of micro structure.
特别是非平面构象、B-ET用高锰酸钾刻蚀也观察到微纤的条带织构。
Another copolyester B-ET was treated by permanganic etches, also demonstrating the fibrillar banded texture.
介绍了利用软刻蚀紫外模塑技术制作复制聚合物折射和衍射微透镜阵列的工艺过程。
Fabrication process of polymer microlens arrays is introduced based on soft lithographic UV-molding replication method.
针对微加工工艺过程造成的残余应力，文中提出了喇曼在线测量方法，并对最常用的三种微加工工艺：淀积、腐蚀或刻蚀及键合进行了喇曼在线测量。
This paper puts forward an online measuring method for measuring the stress in silicon samples prepared with three common micromachining processes: deposition, etching, and bonding.
首先，采用紫外光刻和化学湿法刻蚀技术在玻璃基片上加工微米深度的微通道；
The microchannels were firstly constructed on a glass substrate by standard UV photolithography and wet etching technique.
制作的单晶衬底平面应与晶体001面呈一夹角，沿着晶体001面倾斜的方向刻蚀成超导薄膜微桥。
The prepared monocrystalline substrate plane has an Angle to crystalline 001 plane and superconductive film microbridge is etched in the inclined direction to 001 plane.
本发明可改善应变金属氧化物半导体器件的制造中刻蚀沟槽时的微负载效应。
The invention can improve the micro-loading effect while etching the grooves in the process manufacturing the stress metal oxide semiconductor device.
利用电子束光刻、等离子体增强化学气相沉积、感应耦合等离子体刻蚀来实现跑道型微环谐振器的制备；
The optical part can be done by applying Electron Beam Lithography (EBL), Inductively Coupled Plasma (ICP) etching, and Plasma-enhanced Chemical Vapor Deposition (PECVD).
文中对准分子激光直写刻蚀芯片微通道、池的形成机理进行研究，以及分析了键合前后微通道底面粗糙度与加工参数的关系。
The relationship between the microchannel, the pool, the roughness of the chip and machining parameters of excimer laser is researched in paper.
文中对准分子激光直写刻蚀芯片微通道、池的形成机理进行研究，以及分析了键合前后微通道底面粗糙度与加工参数的关系。
The relationship between the microchannel, the pool, the roughness of the chip and machining parameters of excimer laser is researched in paper.
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