该防焊层形成于该可挠性介电层上，以局部覆盖该些引脚，并依不同应用可覆盖或显露该补强金属图案。
The solder mask layer is formed on the flexible dielectric layer to locally cover the pins and to cover or expose the reinforced metal patterns according to different application.
该防焊层形成于该可挠性介电层上，以局部覆盖该些引脚，并依不同应用可覆盖或显露该补强金属图案。
The solder mask layer is formed on the flexible dielectric layer to locally cover the pins and to cover or expose the reinforced metal patterns according to different application.
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