在决策脚本中封装测试套件逻辑。
The encapsulation of the test suite logic in the decision scripts.
公司的主要业务是集成电路封装测试和内存模块装配。
The company ' s primary business is IC component packaging and test and memory module assembly.
您可以通过运行此任务的一个重要的核心封装测试更容易一些。
You can make this task easier by running the test on a handful of important core packages.
成电路制造、封装测试企业，根据企业对园区的贡献程度，在五年内给予一定补贴。
Into circuit manufacturing, packaging testing enterprises, according to the degree of contribution of enterprises to the park, within five years to give some subsidies.
在过去的两年中，伊智主要为200mm和300 mm晶圆探针台和封装测试处理引入了新的技术。
In the last two years, Electroglas has made major new technology introductions for 200mm and 300mm wafer probing and final test handling.
文章将阐述半导体封装测试厂如何选用并有效实施CONWIP系统，以及它在生产控制、降低库存和缩短生产周期上发挥的积极作用。
This often leads to excessive or unbalanced WIP on production line and eventually impacts the output and manufacturing cost. This paper illustrates how CONWIP systems was adopted …
这很快将会改变，但目前，请遵循下几节中的指示来封装、部署并测试您的应用程序。
This will soon change, but for now, follow the instructions in these next few sections to package, deploy, and test your application.
这些测试通常封装了一组相关的步骤，以达到业务目标，而且他们重新绘制了用例图。
These tests generally encapsulate a set of related steps that achieve a business goal, and they resemble a use-case diagram.
这种方法清晰的将决策脚本中的测试逻辑封装与测试脚本中执行的测试动作和验证分离开来。
This approach clearly separates the testing logic encapsulated in the decision scripts from the test actions and verifications performed in the test scripts.
在过去的几年里，测试框架已包括了许多的惯例，这些惯例封装了实际产品的API方法。
Over the years, the test framework had expanded to include a large number of routines that functioned as wrappers around the actual product API methods.
为了使测试成为对象，他们使用了Command模式，该模式“将请求封装成对象，从而可以……建立请求队列或者记录请求”。
To make tests into objects, they used the Command pattern, which encapsulates "a request as an object, thereby letting you […] queue or log requests."
要说明它在处理GUI事件的威力，Rx框架已经在SilverlightToolkit单元测试中使用，并包含源代码，封装在System . Reactive . dll中。
To demonstrate its power in handling GUI events, the Rx framework has been used in Silverlight Toolkit Unit Test and it's been included in its source code, packaged in System.Reactive.dll.
然而，虽然它们确实向设计中添加了更多组件，但它们带来的封装却能够在维护、测试和重用时为我们节约时间。
However, while they do add more components to our design, the encapsulation they bring will save us time when it comes to maintenance, testing, and reuse.
要完成这项操作，可以将记录器生成的三行代码封装到测试脚本的某个单独方法中。
To accomplish this, you can wrap the three lines of code produced by the recorder into a separate method in your test script.
深度暴露的服务会封装底层流程，因而要确保充分的测试范围，这是一种挑战。
Further exposed services encapsulate the underlying process and hence ensuring sufficient test coverage can be a challenge.
这在组件测试中非常有用，如你可以在封装之前确认未测试代码并检查它。
This is immensely useful during component testing, as you can identify untested code and check it before it is shipped.
后面的代码示例使用了窗口小部件封装器类，看上去要直观得多，并且生成相同测试案例所需的编码要少得多。
This latter code example, using the widget wrapper classes, is far more intuitive and takes much less coding to produce the same test case.
另一方面，要使用窗口小部件封装器类生成相同的测试自动化，只需输入下列五行代码即可。
On the other hand, to produce the same test automation using the widget wrapper classes, you would simply enter the following five lines of code.
在工厂组装期间，采用机械设备对阀座和阀门测试封装挤压进行调整。
Adjustments for envelope squeeze on seats and valve testing are done by machine during factory assembly.
全部工艺完成后，片子要进行测试，合格的片子便去封装。
After completely processed wafers are tested, those chips that pass the tests are ready to be packaged.
在工厂组装期间，阀座的封装挤压和阀门测试的调整都是通过机械设备进行操作。
Adjustments for envelope squeeze on seats and valve testing are done by machine during factory assembly.
阐述了温度补偿封装技术的基本原理和结构设计方法，并对封装后的光栅作了温度性能测试。
The principle and structure design of temperature compensation package for FBGs are expatiated, temperature characteristic of packaged FBGs is measured.
但面向对象程序的封装、继承、多态和异常处理机制等新特性却给软件测试带来新的挑战。
But some characters of Object-Oriented programs, such as encapsulation, inheritance, polymorphism, and exception handling mechanism, bring some new challenging problems to software testing.
这种元件采用密封封装，与光纤加固在一起，然后再测试激光器的性能。
The components are enclosed in a hermetically sealed package, the fibers are spliced together, then the DPSS laser is tested for performance.
对于一些多管脚芯片产品，举例说明了一种共地连接、分组测试的方法，克服了该封装有管脚数量限制的局限性。
For high pin-count products, some cases were illustrated using common ground connection and separating the ESD tests to overcome the limitations on SB available leads.
超大规模集成(VLSI)电路产品的开发流程主要包括设计、制造、测试和封装四个步骤。
Developing flow of very large scale integrated (VLSI) circuits is divided into four main steps: designing, manufacturing, testing and packaging.
最后本文还讨论了芯片COB封装后的测试。
In the end, the thesis discusses the chip's test after COB package.
初步的封装试验和测试证明了硅基平台无源对准封装工艺的可行性和可靠性。
The feasibility and reliability of the passive aligning silicon optical bench are proved by the packaging experiments and test.
例如，我们在测试方法中使用的文字封装了两行，因为页面的宽度比较窄。
For example, the literal we use in the test method has wrapped onto two lines because the width of a printed page is narrow.
该CD还包括对软件封装和测试折叠哪两个立体演示版本模板在3 - D。
The CDs also included a demo version of packaging software which folds and tests two-dimensional templates in 3-D.
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