介绍了氩气保护自动堵孔焊技术及其所用设备、换气焊接系统、焊接电源等。
The technology and equipment of automatic stop up hole welding with argon gas protection, scavenging welding technique and welding power supply are introduced.
本文介绍了“内孔焊”结构的特点、优点以及该结构在我国某化肥厂装置中的设计、制造和运行。
This article introduces foe characteristic and advantage of inner hole welded structure, and its designing, fabricating and running in a chemical fertilizer plant.
用内孔焊结构代替传统的端面焊结构是提高换热器管子与管板焊接接头抗应力腐蚀和缝隙腐蚀稳定性的根本途径。
Substituting inner-hole welding construction for traditional end surface welding construction is a fundamental method for raising the stabilities of anti-stress corrosion and anti-slit corrosion.
采用喷流焊的方法拆除这些通孔元件可以避免这些问题。
Using the method of jet welding dismantling these through-hole components to avoid these problems.
将电路板放置在焊台上，针对需要焊接的通孔元件管腿，选择合适的喷锡口，启动波峰焊接。
The circuit board is placed in the welding stage, the pins through hole components welding, choose appropriate spray tin, soldering start.
传统的通孔元件的焊接采用波峰焊或手工焊接。目前电路板上表面贴装元件和通孔元件混合在一起。
Through hole components welding using traditional manual welding or soldering. The circuit board surface mount components and through-hole components mixed together.
网印：在板两面完全涂覆阻焊油墨，包括导通孔、焊盘。
Screen Print: Solder mask coating will cover completely the panel holes, pads and traces, on both sides.
介绍了压力容器人孔接管与厚壁筒体相焊时，如何控制产品的质量，避免产生裂纹，焊后通过超声波检测及时发现缺陷。
The paper introduced briefly produce quality control in pressure vessel′s shell and manhole nozzle welding, how avoided crack and found defect by ultrasonic testing after welding.
但多数情况下，只能采用焊接的方法，将芯线焊在孔形插针的尾部。
However, in most cases, only the use of welding method, cored wire solder in the pin-hole-shaped tail.
通孔拐角附近是应力应变的集中区，沿界面至焊盘外缘，应力应变逐渐降低。
The stress-strain concentration is detected at the corner of Cu pad, the lower stress for the outer of Cu pad.
论述了内孔喷焊装置的设计原则，并提出了两种规格机筒喷焊的最佳规范。
The principles to designed the hole used plasma gun is discussed and two kind of spraying welding procedures are put forward.
法兰允许按箱体分段制作固焊；接头处打坡口，工地拼接；法兰板连接孔须两两配钻制孔。
Flanges may be made by sections; joints shall be beveled and field welded; bolt holes of two connecting flanges must be drilled together.
印制板试样必须经过MIL—P—55110标准浮焊试验，然后对金属化孔进行剖视。
PWB samples were subjected to the solder float test per MIL-P-55110 and then the PTHs were cross-sectioned.
介绍了钢制柱型散热器连接孔薄板内孔CO_2自动焊设备及工艺。
The paper introduces CO_2 arc process and equipment for welding the connecting hole joints of thin steel column radiators.
测试和实焊表明，带有斜孔导气装置的TIG气冷焊枪，保护性能稳定可靠，结构简单，具有推广价值。
The results show that the stable and reliable shielding gas can be obtained with a simple gas cooling TIG gun when it possesses oblique holes on the nozzle device.
介绍了通孔回流焊的概念、特点、分类和使用工艺要点。
The things of through-hole reflow's concept, characteristics, division and technical gist are described in this paper.
当焊盘面积大于孔壁表面积的66%。提高锡膏有效转移的可能性。
When the pad area is greater than 66 percent of the aperture wall surface area, the probability of achieving efficient paste transfer is increased.
在钢网的特定区域，根据孔的密度，有必要只印刷焊盘的一部分。
Depending on the density of the apertures in a particular region of the stencil, it may be necessary to print on only a portion of the pad.
在打螺栓孔的时候是不可以把螺栓孔打在有大型法兰焊口的地方的。
When a bolt is not to play in a large flange bolt hole welding place.
传统的通孔元件的焊接采用波峰焊或手工焊接。
Through hole components welding using traditional manual welding or soldering.
湿膜、液态感光阻焊的干燥和固化；也可用于网版的干燥；板材和孔壁的干燥等等。
Dry and solidify the wet film, liquid light sensitive resistance welding, dry the net board and hole wall, etc.
以波峰焊工艺焊点强度为标准，研究在不同钎料量下通孔再流焊焊点的强度。
This study benchmarked the strength of solder joints formed through the Through - Hole Reflow process against the traditional wave soldered joint.
用此工艺焊补铸件，焊补区域与基体间没有明显的熔合线，无渣孔、气孔等缺陷。
By using this process to repair castings, there is no obvious separating line, no slag inclusion and gas hole between the welding zone and base metal.
撬块包里所有没有使用的孔都密封，撬块要焊在其地基上。
All unused openings on the package skid are sealed, and the skid requires sealing to its foundation upon installation.
一种用于从电路基板垂直去除多余焊料的方法，该方法包括利用具有可吸附焊料的多个焊盘和孔的牺牲电路基板(60)。
A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate (60) with a plurality of pads and vias that are solder-wettable.
有时孔口应偏移，因此，他们不直接正对焊盘中央。
Sometimes aperture openings need to be offset so they are not centered directly over pads.
该牺牲电路基板的焊盘和孔与该电路基板的多余焊料垂直接近地放置(64)。
The pads and vias of the sacrificial circuit substrate are placed (64) in vertical proximity to the excess solder of the circuit substrate.
在电路板的焊盘上开设缺口，该缺口与定位孔相距一定间隔，可避免出现漏锡。
The bonding pad of the circuit board is provided with the gap, the gap and the positioning hole are spaced by certain interval to avoid tin leaking.
孔或焊，通过印刷电路板通常采用小钻头的硬质合金。
Holes, or vias, through a PCB are typically drilled with tiny drill bits made of solid tungsten carbide.
孔或焊，通过印刷电路板通常采用小钻头的硬质合金。
Holes, or vias, through a PCB are typically drilled with tiny drill bits made of solid tungsten carbide.
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