概述了应用高功能厚膜印刷技术形成双面，多层电路和嵌入无源元件。
This paper describes the formation of double side and multilayer circuit, and embedded passive component using high function thick film printing technology.
概述了应用高功能厚膜印刷技术形成双面，多层电路和嵌入无源元件。
This paper describes general situation of printable electronics, high function thick film printing technology and it's application.
在例如一个实施例中，地面101包括多层电路板的若干相互连接的层。
In one embodiment for example, the ground surface 101 includes several inter-connected layers of the multi-layer circuit board.
在多层电路板制造工艺中，层压技术是十分重要的一个环节，层压的质量和可靠性对电路板的雕刻最终质量起着关键的作用。
In the multi-layer circuit board manufacturing process, the laminating technology is an important aspect of the quality and reliability of laminated board carving the final quality plays a key role.
制造集成电路需要将如半导体和金属等多层材料放置在硅片上。
Making integrated circuits involves depositing layers of materials such as semiconductors and metals on a silicon wafer.
该电路应用于溅射镀膜机上，可较精确地控制多层合金膜镀层。
It has been applied in sputtering coater system to obtain multi-layer alloy film accurately.
金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
多层共烧氮化铝陶瓷是采用厚膜印刷的方式将多层的电路金属化做入氮化铝基板并在特定气氛中高温烧结的一种高性能陶瓷。
Multilayer co-fired AlN ceramic is a type of high performance ceramic that is printed in thick film to form multilayer circuit and fired in a certain atmosphere in high temperature.
这里采用了模式分析和有限元相混合的方法来分析多层无源电路。
The technique facilitates the modeling of multilayered passive circuits using the hybrid mode matching and finite element method (MM/FEM).
可选双功放电路，波罗的海桦木箱体，多层催化涂漆，可选白色，灰色或不涂漆。
Optional bi-amp circuitry. Baltic birch plywood enclosure with catalyzed multi-layered finish, available in white, gray and unfinished.
通过构造一个特殊的多层前向神经网络，利用模拟并行测量装置的基本原理，设计了相应的谐波监测电路。
Using the basic principle of analog parallel harmonics measurement and a special multi-layer feedforward neural network, a corresponding harmonics measurement on-line is built.
多层板生产工艺流程复杂，因此在交期上相对时间会比较长，价格也会略高于双面电路板产品。
Sandwich plate production process is complex, therefore, relatively in the delivery time is not long, the price will be slightly higher than the double-sided circuit board products.
本文通过微波网络分解，将复杂的多层微波电路分解为结构相对简单的子结构电路进行分析。
Through microwave network decomposition principle, we divided multilayered microwave circuit into simple circuit of sub-structure to analyze.
本发明涉及多层介电结构的生产并涉及包含这些结构的半导体设备和集成电路。
The invention relates to the production of multilayered dielectric structures and to semiconductor devices and integrated circuits comprising these structures.
并对多层陶瓷电容器的优化设计方法进行探讨，用具体电路说明了优化设计过程。
With a specific circuit as an example, optimal design of the circuit using MLCC were discussed.
HDI材料技术、细间距电路形成和微导通孔形成的加工技术支持了积层多层板的开发。
This development of build up-type multilayer PWB is supported by HDI materials' technology, as well as processing technology for fine-pitch circuit formation and fine-via formation.
目前流行的多层微波电路技术，正是三维空间电路技术重要应用之一。
The current popular multi-layer microwave circuit is one of the most important applications in the three-dimensional space technology.
此外本发明还通过采用多层pcb电路设计实现了容量大、成本低的优点。
In addition, with the adoption of a multi-layer PCB circuit design, the invention has the advantages of high capacity and low cost.
通孔作为垂直互联的主要实现方式在多层印制电路板和芯片封装中起着至关重要的作用。
As a vertical interconnect channel, through-hole plays an important role in multi-layer PCBs and IC packages.
本发明还提供使用由该纤维增强复合材料制成的透明基板的透明多层片、电路板和光波导。
A transparent multilayered sheet, a circuit board, and an optical waveguide are also provided which use a transparent substrate formed from this fiber-reinforced composite material.
选择性焊接制程提供相关机会以制造不同层次的焊接，连接元件外壳，接合点，铝部件，多层印刷电路板和其它。
The selective soldering process offers opportunities to make solder connections on different levels, connecting housing, junction boxes, aluminum parts, stacking PCB's and more.
选择性焊接制程提供相关机会以制造不同层次的焊接，连接元件外壳，接合点，铝部件，多层印刷电路板和其它。
The selective soldering process offers opportunities to make solder connections on different levels, connecting housing, junction boxes, aluminum parts, stacking PCB's and more.
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