介绍了晶圆键合工艺、技术要求、应用选择以及对MEMS的作用；展示了MEMS制造技术和应用前景。
Introduces wafer bonding process, technical requirements, application choice and Interaction for MEMS, and showing MEMS fabrication technology and application prospects.
在创建另一个椭圆选区时按住 Alt 键，这样就能用这个圆减去原来那个外圆，于此你就得到下面展示的示意图那样的按钮灯外环厚度。
While holding Alt create another elliptical selection so that you would subtract the original selection to leave you with the thickness of the outer button's light as shown in the illustration below.
游戏同样采用作弊系列的圆头小人，熟练的操纵方向键，开始冒险吧。
Cheating using the same game series head mean and skilled manipulation of key, it began to take risks.
介绍了三种典型的圆片键合强度表现形式：抗拉强度、剪切强度和粘接强度。
Three typical manifestations of wafer bonding strength were introduced as tensile strength, shear strength and adhesive strength.
理由5：按键是蓝绿色的、圆胖的、水晶透明的，更重要的是，左右的功能键和导航键都是在一起的，构成米奇的脑袋。
Reason 5: Has blue-green, rotund, and semi-crystal keys. What's more, the left and right function keys and the navigation key combined form the head of cute Mickey.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
节圆是一个参考圆，花键的键齿的所有的横向尺寸都是以节圆为基础开始计算的。
Pitch circle is the reference circle from which all transverse spline tooth dimensions are constructed.
对近紫外圆二色作为光谱探针，研究蛋白质中芳香氨基酸残基、二硫键微环境的变化作了简单介绍。
The method that near-UV CD spectrum served as useful probes to provide the information of dissymmetric environments of aromatic residues and disulfur bonds is also introduced briefly.
作为半导体制造领域的一项新兴的使能技术，晶圆直接键合已经在越来越多的领域发挥了重要的作用。
As one of the newly-emerged enabling technologies, wafer direct bonding has been playing key roles in more and more fields.
作为半导体制造领域的一项新兴的使能技术，晶圆直接键合已经在越来越多的领域发挥了重要的作用。
As one of the newly-emerged enabling technologies, wafer direct bonding has been playing key roles in more and more fields.
应用推荐