决定功率电路的印制板设计方案。
功率电路的印制板设计方案。
汽车电子产品是印制板的一个重要市场。
印制板，阻焊膜，丝网印刷，品质控制。
Printed circuit board, Solder mask, Flood screen printing, Quality Control.
该锌-镍合金作为印制板用压延铜箔的阻挡层。
The alloy coating obtained is used as the barrier layer of wrought rolled copper foil in PCB manufacturing.
ZDH系列预热机主要用于印制板在冲切前的预热。
ZDH series preheater is mainly used to preheat the PCB before impact cutting.
概述了印制板和安装基板的外观检查技术的现状和动向。
This paper describes the current state and trend of external inspection technology of printed circuit board and mounting substrate.
在印制板组件的清洗中，过去一直采用CFC汽相清洗。
CFC vapour phase cleaning machine used to be used in printed circuit assemblies cleaning.
保护通常是通过屏蔽继电器实现的，并且布线在印制板上。
The guard is usually implemented with shielded relays and traces on a printed circuit board.
简单介绍两种陶瓷粉填充微波多层印制板的制造工艺流程。
The fabrication procedure of two kinds of microwave multilayer printed circuit board filled with ceramic particles is briefly introduced.
印制板工艺，容量，质量，可靠性试验标准和数据库。
Printed Board Process, Capability, Quality and Relative Reliability Benchmark Test Standard and Database.
导线在接插件焊杯内的焊点和导线在印制板上的焊点的焊接质量。
The welding quality of the solder joint on the conducting wire connected with the soldering cover and the PCB.
通道电阻包括闭合触点的电阻、印制板走线和输出连接器的电阻。
The channel resistance includes the resistance of the closed contact, the printed circuit traces, and the output connectors.
介绍了一种在现代印制板生产中使用的碱性蚀刻盐及其工作原理。
Introduce an alkaline copper etchant used for the manufacture of printed circuit boards and the way it works.
最后提出了用户电路板中印制板电源、地线布线设计时应注意的问题。
Finally, it indicates the problems to which one should pay more attention when designing power and ground wire in Subscriber Circuit Board.
应变测量基础——介绍应变，应力，印制板弯翘的概念以及应变片等。
Fundamentals of strain Measurement -definition of strain, stress, board flexure and strain gages.
铝衬微波印制板作为一种复合材料，其切削机制不同于一般的金属加工。
As a kind of complex material, the aluminum base microwave printed circuit board has a different cutting mechanism from general materials.
碳膜印制板价格低廉、质量稳定，尤其适用于带有按键功能的电子产品。
The carbon-film PCB has advantages of low price and stable quality, so it is applicable for production of keyboard on electric products.
该测试系统可被用于各种装置，例如连接器、开关、多芯电缆和印制板。
This test system may be used on a variety of devices, such as connectors, switch es, multiple conductor cables, and printed circuit boards.
本文对电路印制板的测试技术进行了分类，介绍了在线测试和在线测试仪。
This paper classifies the testing technologies of PCB, introduces the on-line testing and on-line tester.
针对印制板生产现场的成本管理，提出系统的思路，并举出实际操作的例子。
In view of the work field cost management of the PCB manufacturing, advance systematic train of thought and give out some practical examples.
其中包括对印制板的布线、电容性耦合、数字电路的噪声容限和传输线的探讨。
It includes wiring of printed circuit board, electric capacity coupling, tolerance of digital circuit noise, and transmission line.
如果某块PC B具有低绝缘电阻(IR)，则会大大降低印制板上电路的性能。
If a PCB has low insulation resistance (ir), it can degrade the performance of the circuits on the board considerably.
今天，凡是在刚性多层板的技术进步，同样，在刚-挠性印制板也是能够实现的。
Today, all developments regarding rigid-multilayer board have been implemented to rigid-flex printed circuit boards.
本文探讨印制板生产厂商在形成高层数大规格背板时将面临一些什么样的技术挑战。
A discussion of what technology challenges face the fabricator in creating high-layer count, large format back panels.
从零件放置、布线和补铜箔等三个方面讨论了在双面印制板设计中如何控制电磁干扰。
The paper discusses how to control the EMI in designing twolayer PCB at three points:part placement, routing and copper pour.
设计一个合适的保护开关的最难点是适合印制板上的所有布线，并保证适当的电压空间。
The hardest part of designing a properly guarded switch is to fit all the traces on the board and maintain proper voltage spacing.
在有些应用中，例如测试电缆和印制板的绝缘电阻及耐压测试，可能需要切换高压信号。
Some applications, such as testing insulation resistance of cables and printed circuit boards and high-pot testing, may require switching high voltages.
测量绝缘电阻的例子包括测量印制板上走线之间的通路，或多芯电缆中导线之间的电阻。
Examples of insulation resistance measurements include measuring the path be tween traces on a printed circuit board or the resistance between conductors in a multi-conductor cable.
同时，为了达到微型化的设计目标，选用了低功耗的表贴元件、双层印制板制作电路板。
At the same time, For the purpose of the micromation, low-power surface mounting components and double deck printed circuit board are employed.
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