根据本样品的单晶结构数据对谱线指派和有关穆斯堡尔参数作了阐述。
The assignment of iron absorption doublets and the obtained Mssbauer parameters are discussed based on the single crystal structure data of the sample studied in this work.
由于线锯切割具有切片薄、表面翘曲变形小、厚薄均匀和切口损失小等优点，被广泛用于单晶硅切片加工。
The wire sawing process has been applied to slice single silicon into thin wafers for its character of minimum warp, uniform thickness and low kerf loss.
对三个加成产物进行了X -线单晶结构解析，验证了产物的结构和相对立体化学。
Furthermore, X-ray single crystal structural analyses were performed for three adducts, whose structures and relative stereochemistry were confirmed.
本机采用金刚砂线锯技术，用于切割单晶硅棒、多晶硅方棒。
The cutter is used to cutting mono-crystal silicon rod and poly-silicon cube with the technology of monocrystalline wire saw.
本机采用金刚砂线锯技术，用于切割单晶硅棒、多晶硅方棒。
The cutter is used to cutting mono-crystal silicon rod and poly-silicon cube with the technology of monocrystalline wire saw.
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