半导体芯片体积小而且重量轻。
体积小，重量轻的半导体芯片。
半导体芯片体积小，重量轻。
提供了改进的半导体芯片制造的系统和方法。
A system and method for improved semiconductor die production is provided.
“炬力芯片”指炬力研发并提供的半导体芯片。
"Actions chip" means the semiconductor chip designed and provided by Actions.
它是一种以半导体芯片作为存储介质的存储器。
It is a kind of storage device using semiconductor device as storage medium.
在半导体芯片制造过程中，结深是重要的工艺参数之一。
The depth of diffusion junction(Xj)is one of the most important parameters in wafer Fab.
本文描述了使用共面微波探针的半导体芯片在片测试技术。
We present an on-wafer measurement technique of semiconductor wafer using special coplanar microwave probes.
方法和化学沉积浴场，半导体芯片上使用四个优先铜铜电解池。
Method and baths for electroless depositing Cu on a semiconductor chip using four preferred Cu electroless baths.
半导体芯片体积小而且重量轻。 半导体芯片体积小而且重量轻。
本发明提供了半导体晶片、半导体芯片及处理晶片的方法和设备。
The invention provides a semiconductor wafer, a semiconductor chip and a method and an apparatus for processing the wafer.
以及用树脂密封被减薄的所述半导体芯片的侧表面和所述第二主表面。
Side surfaces and the second main surface of the semiconductor chip made thin are sealed with resin.
电极部分设置于在半导体芯片的厚度方向上与传感器元件不重叠的位置。
The electrode portion is placed in a position which does not overlap with the sensor element in the thickness direction of the semiconductor chip.
探针卡，该探针卡的设计方法，以及使用该探针卡测试半导体芯片的方法。
Probe card, method of designing the probe card, and method of testing semiconductor chips using the probe card.
作为一家致力于半导体芯片研发设计的公司，高拓讯达秉承团队合作的精神。
As a company which is focused on IC design, AltoBeam has established highly motivating R&D environment and flexible working style with team spirit at the center.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
至少一个半导体芯片(例如麦克风芯片)安装在基座部上并且在屏蔽板的正上方。
At least a semiconductor chip (such as a microphone chip) is arranged on the base part and right over the shield plate.
欧胜微电子是一家为消费电子市场提供高性能混合信号半导体芯片的全球领先公司。
Wolfson Microelectronics is a global leader in the supply of high performance mixed-signal semiconductors to the consumer electronics market.
不好的消息是，松下不得不首先对三洋公司生产电子产品、半导体芯片和家用电器的部门进行改组。
The bad news is that Panasonic will first have to restructure Sanyo's divisions that make electronics, semiconductor chips and home appliance.
介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。
This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital image Processing and Pattern Recognition.
半导体芯片生产的特殊性在于其生产分段在不同的代工厂进行，生产周期长且动态变化大。
The special characteristics of IC production are that the different production stage located at different factory and its long dynamic cycle time.
本文叙述的半导体芯片及红外敏感器的某些近期进展可能为智能武器的研制展现了广阔的前景。
This paper describes some recent progresses in semiconductor chips and infrared sensors which may possibly open up broad prospects for the development of brilliant weaponry.
本文叙述的半导体芯片及红外敏感器的某些近期进展可能为智能武器的研制展现了广阔的前景。
This paper describes some recent progresses in semiconductor chips and infrared sensors which may possibly open up broad prospects for the development of brilliant we...
本发明提供一种半导体装置，提高了从多个半导体芯片产生的热的扩散效率，并可靠地与散热路径连接。
The invention provides a semiconductor device which can increase heat diffusion efficiency generated by a plurality of semiconductor chips, and connects with a heat diffusion path reliably.
LCD屏幕和半导体芯片与太阳能电池拥有同样的材料和制造过程，许多工厂都从生产一种产品转向了生产另一种。
LCD screens and semiconductor chips share the same materials and manufacturing processes as solar photo-voltaic cells; many factories have simply been converted from one to the other.
通过研磨所述半导体芯片的与所述第一主表面相对的第二主表面，使所述半导体芯片减薄，所述半导体芯片与所述基板相连接；
The semiconductor chip is made thin by grinding a second main surface opposing to the first main surface of the semiconductor chip which is connected with the substrate.
通过研磨所述半导体芯片的与所述第一主表面相对的第二主表面，使所述半导体芯片减薄，所述半导体芯片与所述基板相连接；
The semiconductor chip is made thin by grinding a second main surface opposing to the first main surface of the semiconductor chip which is connected with the substrate.
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