至少一个半导体芯片(例如麦克风芯片)安装在基座部上并且在屏蔽板的正上方。
At least a semiconductor chip (such as a microphone chip) is arranged on the base part and right over the shield plate.
至少一个半导体芯片(例如麦克风芯片)安装在基座部上并且在屏蔽板的正上方。
At least a semiconductor chip (such as a microphone chip) is arranged on the base part and right over the shield plate.
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