铜的化学符号是什么？
本文研究了在实际电化学条件下铜在金表面的低电位沉积
In this work, copper underpotential deposition on gold is studied under realistic electrochemical conditions
现在这项作品正在“米兰国际家具展览会”参展，其供电的能源来自西红柿中的酸性物质，锌和铜之间发生的化学反应。
Currently exhibited at the Milan Furniture Fair, the design collects energy from a chemical reaction between tomato acids, zinc, and copper.
虽说锡层脱落时这口锅还是能用的，但你必须保证每次在烧菜前用力擦洗锅子，而且菜一烧好就得马上出锅，因为烧好的菜可能会跟锡层已经脱落的铜锅发生有毒的化学反应，所以最好还是及时地重镀锡层。
If cooked food remains in a poorly lined pot, some kind of a toxic chemical reaction can take place. It is thus best to have the pot re-tinned promptly.
铜（29），镍（28），锌（30）在化学周期元素表中紧挨着彼此，并且它们还拥有一些相同的特性。
AS WELL as being close to each other on the periodic table, copper, nickel and zinc share several traits.
选择铜锰进行研究是因为它们位于欧文·威廉姆斯化学序列的对立两方，选择这些金属的蛋白应当有特定需求。
These metals were chosen because they lie towards opposite ends of a chemical series called the Irving-Williams series, such that selecting these metals for proteins should be especially demanding.
其最大的难点是化学沉铜前的聚四氟乙烯活化前处理，也是最为关键的一步。
The biggest difficulty is chemical deposition of copper of PTFE activation pretreatment, is also the most crucial step.
化学分析显示铜的含量很高。
略带蓝色的部分是硝酸铜和硝酸锌，一种化学反应后的产物。
The scattered blue particles are cupric nitrate and zinc nitrate, a byproduct of the chemical reaction.
金属铜与塑料的膨胀系数比较接近，因此，在塑料电镀中常用化学镀铜层作为电镀的导电镀层。
Copper and plastic coefficient of expansion, and, therefore, more close to the plastic used in electroplating electroless copper plating coating layer as conductive.
从工艺流程、配方、质量影响因素等方面，介绍一种在铜及其合金表面着自然铜绿的化学着色新工艺。
This paper introduces a new chemical colouring technology for copper and its alloy surface to colour a Verde green with respect to technical process, prescription, quality control and so forth.
此外，还介绍了化学退铜溶液的配制方法及注意事项。
The method of preparing the solution and points for attention are also introduced.
正是这些化合物形成的化学结合提高了金刚石薄膜和铜衬底间的附着力。
Chemical bonds combination because of the existence of such kinds of compounds could greatly improve the adhesion property.
化学沉铜是否对电镀空洞有积极的持续改善小组？
Is there an active continuous improvement team for plating voids in the electroless copper operation?
本区为铜的地球化学高背景场区，具有较好的铜矿成矿条件。
This area is the geochemical one with high copper background value and has the favourable condition for copper mineralization.
半导体器件上铜层化学机械抛光(CMP)的第一道工序一般需要使用一块硬抛光垫，在磨去阻挡层的工序中要用到软垫。
Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.
以菠菜叶为原料，95%乙醇为溶剂提取叶绿素，通过化学法制得叶绿素铜钠盐。
Using spinach leaves as row material, chlorophyll was extracted with 95%ethyl alcohol and sodium copper chlorophyllin was made by chemistry.
通过实验手段，研究了稀土对电沉积法制备泡沫铜化学预镀工艺的影响。
The effect of rare earths on the chemical pre-plating process for electro-deposition of foamy copper was studied through experiments.
铜髣卤簇合物的结构化学极其丰富多彩。
Copper halide clusters show a variety of frameworks in the structure chemistry.
化学位图分析表明，铜离子总浓度是影响氯脱除率的主要因素。
The diagram of chemical potential shows that the total concentration of cupric ions is main influence factor on chloride precipitation.
探索用化学还原法制备纳米铜粉的可行性。
The feasibility of prepared nanometer-scale copper powders by chemical reduction method was studied.
从热力学、电化学、溶液化学等方面，研究和探讨了细菌浸铜溶液体系中杂质的行为。
The impurity behaviors in the solution system of bioleaching copper were studied and discussed by thermodynamics, electrochemistry and solution chemistry.
总结了目前国内外关于铜及其合金的着色工艺，系统地归纳了化学和电化学着色的配方。
The present technical process for coloration of copper and its alloy were reviewed. Furthermore, many chemical and electrochemical coloring methods were summarized.
通过对化学镀铜膜形貌和结晶方面的研究发现：籽晶层对铜膜最终形貌和择优取向有较大的影响。
Through the study, we find that the morphology and crystallography of the seed layer has an important effect on the as-deposited Cu films.
采用电化学动电位扫描和交流阻抗研究了铜在模拟斯德哥尔摩雨水中的腐蚀行为。
Corrosion behavior of copper in a simulated rainwater of Stockholm area was studied by electrochemical impedance spectrum and polarization curves.
采用失重法和电化学方法对铜在模拟苦咸水溶液中的腐蚀电化学行为进行了研究。
The electrochemical behaviors of copper in the simulating bitter and brackish solution was studied using weight method and electrochemical techniques.
为了获得性能优良的电化学沉积合金薄膜，需要精度非常高的合金薄膜铜衬底。
To obtain the amorphous alloy films with superior properties by electrochemical deposition, the accuracy requirement of copper substrates is extraordinarily strict.
为了获得性能优良的电化学沉积合金薄膜，需要精度非常高的合金薄膜铜衬底。
To obtain the amorphous alloy films with superior properties by electrochemical deposition, the accuracy requirement of copper substrates is extraordinarily strict.
应用推荐