去除塑料包封层，露出芯片表面，是DPA(破坏性物理分析)及FA(失效分析)的关键一步。
It is a crucial step for destructive physical analysis (DPA) and failure analysis (fa) to remove the plastic package for the die exposing.
解决问题的方法：一种叠层包转材料由热塑性材料最外层、纸基材料层、导电阻挡层和热封最内层构成。
A laminated packaging material is composed of a thermoplastic material outermost layer, a paper base material layer, a conductive barrier layer and a heat sealing innermost layer.
解决问题的方法：一种叠层包转材料由热塑性材料最外层、纸基材料层、导电阻挡层和热封最内层构成。
A laminated packaging material is composed of a thermoplastic material outermost layer, a paper base material layer, a conductive barrier layer and a heat sealing innermost layer.
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