但当他学会吃不同的水果和蔬菜的时候，他的肤色也变得匀和了。
His skin tone eventually evened out as he learned to eat different vegetables and fruits.
生产厂主要关心的是纤维的颜色均匀和一致，不存在可见的色差。
The key concern of the manufacturer is that the color of the fiber is uniform and consistent, with no visible variations in color.
研究表明：适量提高剪切速率或降低温度，半固态组织的固相颗粒会变得细小、均匀和圆整。
The results showed that the solid particle became finer, more homogeneous and rounder with the decrease of temperature or the increase of shearing rate.
脂肪肉瘤肿块密度不均匀和溶骨性骨质破坏。
The Liposarco-rna always showed inhomogeneous density mass accompanied with lytic bone destruction.
这是由于变形不均匀和晶界上析出的平衡脆性相耦合作用的结果。
This is due to the coupling of inhomogeneous deformation and the brittle equilibrium phase on the boundary.
超细纤维染色中存在着染色深度下降，染色不匀和染色牢度降低等问题。
There are some troubles in microfibre dyeing, such as decrease in dye depth, uneven dyeing, poor fastness and so on.
二次浸锌得到的锌晶粒比一次浸锌更细小、均匀和致密，对基体覆盖能力好。
Finer, more uniform and denser zinc crystals were attained by secondary zinc coating with better covering capacity.
对于小件的肉类，如鸡翅、薄块肉类等，必须平放在碟上，才可均匀和快捷地解冻。
For small pieces of meat such as chicken wings, thin pieces of meat and so on, must be flat on the plate in order to evenly and quickly thaw.
为此，对该路基采用了旋喷注浆和静压注浆加固，使不均匀和开裂得到了有效的控制。
For this, rotary jet grouting and static grouting were adopted for strengthening the roadbed, and the unevenness and cracking have been well controlled.
当各规划小区话务量分布不均匀和蜂窝小区结构不规则时，这种传统方法受到诸多限制。
The traditional methods are usually subject to various kinds of constraints, because the traffic density is not well distributed and microcell structure quite irregular.
由于自身刚性的三维结构，它们能够通过溶液旋涂加工的方式形成均匀和无定形的薄膜。
They can form uniform and amorphous films via spin-coating due to their rigid three-dimensional architecture.
应用激光散射测雾技术对均匀和不均匀横向气流中单个直射式喷嘴雾化细度作了试验研究。
A detailed research on the atomization fineness of a plain orifice injector by light scattering technique under uniform end nonuniform cross flowing air streams.
数值研究在初始状态为中等密实和松散砂材料进行，其初始孔隙比按均匀和随机分布考虑。
Numerical investigations are carried out with an initially medium dense and initially loose sand using a homogeneous and random distribution of the initial void ratio.
经测试发现，铸铁的组织均匀和碳化物细小时，其布氏硬度与机械加工性能之间呈线性关系。
The test results shows that there is a linear relationship between Brinell Hardness and the machinability of cast iron with homogeneous microstructure or tiny carbides.
糖类标准物质具有一种或多种足够均匀和很好确定的特性值，用以校准设备、评价测量方法。
Sugar certified reference materials have one or more uniform and are good to determine the characteristics of value, and evaluate method of measuring equipment calibration.
以温度梯度均匀化为准则，利用仿生优化方法得到了域内有均匀和非均匀热源时高导热材料的最优布置。
According to the uniformity principle of temperature gradient, the high conductivity material constructs are optimized by bionic optimization method.
采用有限元法，计算和分析了壁厚不均与椭圆套管在单向均匀和单向椭圆分布外挤力作用下的强度问题。
With finite element method, the collapse strength of casing with ovality and eccentricity under unidirectional uniform and ellipse distributive force was calculated and analyzed.
由于线锯切割具有切片薄、表面翘曲变形小、厚薄均匀和切口损失小等优点，被广泛用于单晶硅切片加工。
The wire sawing process has been applied to slice single silicon into thin wafers for its character of minimum warp, uniform thickness and low kerf loss.
最后给出塔里木油田英买力地区第三系盐层在均匀和非均匀地应力条件下盐岩蠕变引起的套管岩压外载实例。
Finally, the examples of external load due to the salt creep in the tertiary of Yingmaili oil field have been performed under heterogeneous and homogeneous in-situ stresses.
本实用新型解决了由于原来用定时、定速的不稳定、不精确的方式对管道进行预填充所带来的问题，保证了加香的均匀和精确。
The utility model solves the defect that stuffing for pipes is estimated according to an instable and inaccurate method of time and speed fixing and ensures even and accurate spice adding.
该方法能够很好地解决由于无铅钎料的应用引起的日益严重的诸多问题，如球栅阵列中各钎料球受热不均匀和芯片基板与钎料球同时受热等。
It can solve the problems such as inhomogeneous heating of different solder bumps in ball grid array, simultaneous heating of chip and carrier with solder ball, etc.
该方法能够很好地解决由于无铅钎料的应用引起的日益严重的诸多问题，如球栅阵列中各钎料球受热不均匀和芯片基板与钎料球同时受热等。
It can solve the problems such as inhomogeneous heating of different solder bumps in ball grid array, simultaneous heating of chip and carrier with solder ball, etc.
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