指示凹焊缝、凸焊缝或平焊。
拖到绘图页后，可以添加凹焊缝、凸焊缝或平焊。
详细介绍了凸焊密封螺母接头的设计和工艺试验情况。
The status of design and technological experiment of projection welding seal nut joint is introduced in detail.
指示凹焊缝、凸焊缝或平焊。增加高度以配合其他焊接符号。
Indicates concave, convex or flush welds. Increase height to fit above other weld symbol.
用途： 用途：适用低碳钢，不锈钢、铜软胶线等点焊和凸焊。
Usage: suitable for low carbon steel, stainless steel, copper soft glue wire etc spot and convex welding.
焊接和有关技术。电阻点焊凸焊或缝焊搭接接头。带解释的缺陷分类。
Welding and allied processes. resistance spot, projection and seam welded lap joints. classification of defects with explanatory comments.
电容储能凸焊的喷溅问题比交流凸焊更为突出，研究影响喷溅发生的因素就显得更为重要。
The problem of splash is more serious in capacitor discharge projection welding than in ac welding.
研究了焊接过程中焊接电流产生的电磁力对电容储能凸焊喷溅、接头强度及焊接工艺的影响。
The effect of electromagnetic force on the splash, joint strength and welding process of capacitor discharge projection welding is studied.
本文通过凸焊技术在重型汽车驾驶室焊接生产中的应用实例，阐述了凸焊技术的基本原理与焊接特点。
According to some instances of raised welding technology to heavy automobile cab, the paper elaborates the mental principle and characteristics of the welding technology in detail.
简体中文标题：电阻焊接。焊缝的有损检验。电阻点焊、滚焊和凸焊焊缝的疲劳类型和几何学上的测量。
English Name:Resistance welding - Destructive tests of welds - Failure types and geometric measurements for resistance spot, seam, and projection welds.
端面有间隙、带凸台对接外形是指在标准节上部主弦杆上焊有定位凸台，定位凸台伸人另一标准节主弦杆内，上、下套管之间留有一定间隙配合定位。
End face with a gap, no boss butt is refers to the upper and lower casing left a certain gap between the upper and lower main chord rod end face at the same time contact.
文章通过试验证明：纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.
它采用安装在机器人末端的两台摄像机和一只激光器构成测量系统，激光器发出的光束经平凸柱面镜变成光平面，在焊件上形成条纹。
A piano-convex cylinder lens is utilized to convert the laser beam to plane, to forms a stripe on the welding works. Two frames of stripe image are captured by the cameras synchronously.
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
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