具有不同居里点的两种铁电体粉末在共烧时会产生过渡相。
The transitional phase appeared when two ferroelectric powders with different Curie point were mixed and sintered together.
研究低温共烧压电陶瓷组分以及组分，结构及性能之联系。
Study the relationships between compositions, structures and properties of low temperature co-firing piezoelectric ceramics.
研究了叠层共烧工艺制备的微波介质陶瓷器件的银扩散机制。
The silver diffusion mechanism in low temperature cofired microwave dielectric ceramic components fabricated by using multilayer technology was studied.
该螺旋体脉冲发生器包括两个低温共烧陶瓷部件共同制成的部分。
The spiral pulse generator comprises two parts which are manufactured jointly as an LTCC component.
还介绍了低温共烧陶瓷基板以及向微波频率扩展的前景与相应的工艺要求。
Compared with conventional microwave network, the LTCC substrate and its future expanding to microwave and corresponding technical requirements are also introduced in the paper.
指出了不同硼硅酸盐玻璃材料的优缺点和在低温共烧陶瓷技术中的适用范围。
The merits and defeds of different borosilicate glasses, its application field in LTCC technology were indicated.
本文提出一种新型的基于低温共烧陶瓷技术(LTCC)的螺旋电感带通滤波器。
A novel spiral inductor resonator bandpass filter based on LTCC is proposed in this paper.
LTCC技术的实现和进步很大程度上依赖于流延和低温共烧陶瓷这两个关键环节。
Realization and progression of LTCC depends on two key joints of flow casting and low temperature co-fired ceramic in great degree.
LTCC技术的实现和进步很大程度上依赖于流延和低温共烧陶瓷这两个关键环节。
Realization and progression of LTCC depends on two key joints of flow casting and low temperature co - fired ceramic in great degree.
低温共烧陶瓷(L TCC)技术目前正逐渐走向成熟，并成为电子封装领域研究的热点。
With technology of low temperature co-fired ceramic going mature gradually, it evolves to investigative hot spot in the field of electronic packaging.
低温共烧陶瓷(LTCC)技术是实现微波电路与系统小型化、高密度的重要组装和互连技术。
Low temperature co-fired ceramics (LTCC) becomes an important packaging and interconnecting technology for realizing microwave circuit and system's miniaturization and higher density.
通过制备共烧叠层片式元件实验，指出其难点在于内电极的抗氧化性能以及与陶瓷界面接触上。
After the trial of co-fired multilayer chip type component, found the difficulties were oxidation resistance of interior electrode and interface contact between the electrode and ceramic.
现在大规模生产过程中普遍采用共烧来进行生产，即背场和正面银浆使用同一温度共同进行烧结。
Nowadays most of factory use co-fired process, namely using the same temperature to fire front Ag and BSF.
新开发的低损耗、低介电常数的低温共烧陶瓷(LTCC)材料最适合做微波mcm的基板材料。
The newly developed low loss, low dielectric constant and low temperature co fired ceramics (LTCC) materials are the best substrate for microwave MCM technology.
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)一种理想的组装技术。
Low Temperature Co-fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules (MMCM).
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)的一种理想的组装技术。
Low Temperature Co fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multichip modules (MMCM).
钛酸锌微波介质陶瓷因其优异的介电性能、较低的烧结温度，而被广泛应用于制备银、铜电极共烧中温低介微波材料中。
As ZnTiO3 has the outstanding dielectric property and low sintering temperature, it has been mixed with Ag, Cu, etc. to prepare electrodes at relatively low sintering temperature.
本文报告了一种基于低温共烧陶瓷技术和金锡共晶焊料的射频微机电的封装技术，并评估了该封装结构的物理及射频特性。
This paper reports on an RF MEMS package based on LTCC technology and gold-tin eutectic bonding, and also evaluates physical and RF characteristics of the proposed structure.
多层共烧氮化铝陶瓷是采用厚膜印刷的方式将多层的电路金属化做入氮化铝基板并在特定气氛中高温烧结的一种高性能陶瓷。
Multilayer co-fired AlN ceramic is a type of high performance ceramic that is printed in thick film to form multilayer circuit and fired in a certain atmosphere in high temperature.
由于聚合物基复合材料具有无需高温处理、工艺简单等优势，使其在容感两性的集成应用方面相较高温共烧陶瓷基容感两性复合材料具有一定优势；
Plus, the facts, that these polymer composites do not need high temperature treatment and can be easily shaped, make these polymer composites more superior in the application of embedded integration.
多层陶瓷微波滤波器是一种基于低温陶瓷共烧技术的新型滤波器，具有小型化、轻便化和高频化特点，在通信、汽车、数字化家电等产品中已得到广泛应用。
Small size, low weigh and high working frequency are the characteristics of multilayer ceramic microwave filter, and it is now being employed in communication and electric products application.
建立了与高温共烧多层陶瓷基板工艺相适应的工艺参数库、设计规则库和常用封装库，使Cadence公司的MCM系统能适合我所M CM - c设计。
The process data library, the design rule library and the package library were set up in CADENCEs MCM design system, based on high temperature co fire process.
建立了与高温共烧多层陶瓷基板工艺相适应的工艺参数库、设计规则库和常用封装库，使Cadence公司的MCM系统能适合我所M CM - c设计。
The process data library, the design rule library and the package library were set up in CADENCEs MCM design system, based on high temperature co fire process.
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