其中，软件方面，着重分析了TC层的信元定界、解扰、测距等八个子模块的设计以及仿真结果，论述了TC层设计中采用的一些编程优化技术；
As for the software, the designing and simulation result of each sub-module of TC layer is analyzed, during the analysis process, some programming and optimization technique is expatiated.
其中，软件方面，着重分析了TC层的信元定界、解扰、测距等八个子模块的设计以及仿真结果，论述了TC层设计中采用的一些编程优化技术；
As for the software, the designing and simulation result of each sub-module of TC layer is analyzed, during the analysis process, some programming and optimization technique is expatiated.
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