探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
对化学法制备莫来石粉料的研究现状进行了系统的总结，阐述了低温莫来石化的机理。
The current status and progress in the preparation of mullite precursor powders by chemicalmethods and the mullitization mechanism at low temperatures are reviewed.
对化学法制备莫来石粉料的研究现状进行了系统的总结，阐述了低温莫来石化的机理。
The current status and progress in the preparation of mullite precursor powders by chemicalmethods and the mullitization mechanism at low temperatures are reviewed.
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