在一实施方式中，晶体管可包括具有主表面的半导体层和传导结构。
In an embodiment, the transistor can include a semiconductor layer having a primary surface and a conductive structure.
以及用树脂密封被减薄的所述半导体芯片的侧表面和所述第二主表面。
Side surfaces and the second main surface of the semiconductor chip made thin are sealed with resin.
与炭化处理纤维相比，石墨化纤维晶体结构更加完整，沿纤维主表面的取向程度更高。
In comparison with the carbonized fibers, the carbon fibers after graphitization treatment display more perfect crystal orientation along the main surface of ribbon-shaped carbon fibers.
采用本发明的消毒方法，既能充分消灭宿主表面的杂菌，又能最大限度 减少宿主内生菌的损伤。
The said method can kill microbes on the surface of host completely while reducing the damage to endophyte in the host at most.
通过研磨所述半导体芯片的与所述第一主表面相对的第二主表面，使所述半导体芯片减薄，所述半导体芯片与所述基板相连接；
The semiconductor chip is made thin by grinding a second main surface opposing to the first main surface of the semiconductor chip which is connected with the substrate.
通过研磨所述半导体芯片的与所述第一主表面相对的第二主表面，使所述半导体芯片减薄，所述半导体芯片与所述基板相连接；
The semiconductor chip is made thin by grinding a second main surface opposing to the first main surface of the semiconductor chip which is connected with the substrate.
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