垂直互连是三维微波和毫米波集成电路中的典型结构。
Vertical interconnections are typical structures in three dimensional microwave and millimeter wave integrated circuits.
利用商用三维电磁场分析软件HFSS对集成化低噪声放大器组装和互连中的关键参数进行了仿真和优化。
Some critical parameters of packaging and interconnection of the integrated LNA were simulated and optimized by using commercial 3d electromagnetic field analysis software HFSS.
网状聚氨酯泡沫是一种轻质、柔性材料，它由相互连接的经络构成了空间“骨架”结构，这种结构实际上是一种三维的防火屏蔽。
The material is a lightweight flexible foam composed of a skeletal matrix of tiny interconnecting strands which act as a three dimensional fire screen.
网状聚氨酯泡沫是一种轻质、柔性材料，它由相互连接的经络构成了空间“骨架”结构，这种结构实际上是一种三维的防火屏蔽。
The material is a lightweight flexible foam composed of a skeletal matrix of tiny interconnecting strands which act as a three dimensional fire screen.
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