对镀速和镀层厚度进行了测定，并与电镀进行了效果比较。
The deposition rate and coating thickness were determined, and the effects were compared with those of electroplating.
结果表明：复合稳定剂比单一稳定剂镀速高、稳定性好、孔隙率低。
Experimental results indicate that compare to single stabilizing agent, compound stabilizing agent has higher plating rate, better stability and lower porosity.
运用正交试验分析了镀液中各主要组分对镀速及耐蚀性等影响，优选化学镀最佳工艺。
The effects of the main compositions in bath on deposition rate and corrosion resistance of the deposits are analyzed, and the optimum process is determined by orthogonal test.
研究了影响化学镀铜镀速和镀液稳定性的诸因素，并根据实验确定了适宜的化学镀铜液配方及其工艺。
Factors affecting stability and deposition rate of electroless Cu are investigated and proper formulation and process for electroless Cu bath determined.
在其它条件不变的情况下，随着丙酸浓度的增加，平均镀速有所上升，而硬度先上升，达到一个最大值后开始下降。
Moreover, the average rate can rise and the hardness will reach the maximum along with the increasing concentration of propionic acid.
稳定剂提高了镀液的稳定性，通过混合电位-时间曲线的研究和其对镀液稳定时间和镀速的影响，确定了稳定剂的加入量。
The stabilizers can improve the stability of the bath. The dose of the stabilizers is determined by studying the mixed potential-time curves and the impact of stabilizing time on the plating rate.
稳定剂提高了镀液的稳定性，通过混合电位-时间曲线的研究和其对镀液稳定时间和镀速的影响，确定了稳定剂的加入量。
The stabilizers can improve the stability of the bath. The dose of the stabilizers is determined by studying the mixed potential-time curves and the impact of stabilizing time on the plating rate.
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