配位共价键是其中两个键合电子均来自该键所涉及的原子之一的键。
A coordinate covalent bond is one where both bonding electrons are from one of the atoms involved in the bond.
本文介绍了一台自动引线键合装置。
界面键合强弱的影响在两体系中不相同。
The strength of interfacial bonding showed different effect in the two systems.
键合是微流控芯片制作的关键技术之一。
Bonding is one of key processes for fabrication of microfluidic chip.
引线键合是实现微波混合电路的关键技术。
Wire bonding is a critical technique for realizing microwave hybrid circuit.
器件采用微电子机械加工技术和键合技术研制。
The two parts are fabricated by MEMS technology and combined as aw.
结论：帕珠沙星以沟槽键合方式与DNA相互作用。
Conclusion: Pazufloxacin interacts with CT-DNA in the mode of groove binding.
基于键合微平台技术，设计了一种电容式并联开关。
A capacitive shunt switch is designed on the basis of the micro-platform technology.
超声功率是影响粗铝丝引线键合强度的最主要因素之一。
The influences of ultrasonic power on heavy aluminum wire wedge bonding strength were investigated.
BP网络用于金丝键合质量的预报具有可行性和有效性。
That BP network used for predicting quality of wire bonding is feasible and valid.
聚乙二醇键合相已用于高效疏水作用色谱分离活性蛋白质。
The polyethylene glycol (PEG) beaded phase has been employed for biologically active proteins by high performance hydrophobic interaction chromatography.
本文介绍了某微波组件芯片剪切力和键合强度的改进案例。
In this paper, an improvement example of die shear strength and bond strength of a microwave module is introduced.
针对一种用键合线连接的简单封装模型进行射频性能的模拟。
The RF characteristics of bonding wire interconnection in a simple package model were simulated.
固体酸是将酸性基团键合或负载于不溶性载体上的一类催化剂。
Solid acids are a series of catalysts that acidic groups were bonded or supported on unsolvable supporters.
在超声引线键合过程中，键合力是影响键合强度的重要因素之一。
In ultrasonic wire bonding process, the bonding pressure is one of the most important factors to the bonding strength.
阐述了建立空间多体系统键合图模型的一般方法及其动力学原理。
The method of modeling spatial multibody systems by bond graphs and its dynamic principle are described.
科学家们忙于填补元素周期表的空白、探索未知的原子现象(如放射性和键合)。
Boffins were busily filling in the blanks in the periodic table and probing unknown atomic phenomena (like radioactivity and bonding).
本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。
This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.
认为这些平面氢键可以通过进一步键合来形成硬段微区中的三维氢键。
Three dimensional hydrogen bonding in hard segment domains can be formed by further bonding of the above planar hydrogen bondings.
气体等离子技术能够用于在引线键合前清洗焊盘以改进键合强度和成品率。
Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.
介绍了三种典型的圆片键合强度表现形式：抗拉强度、剪切强度和粘接强度。
Three typical manifestations of wafer bonding strength were introduced as tensile strength, shear strength and adhesive strength.
硅片键合往往与表面硅加工和体硅加工相结合，用在MEMS的加工工艺中。
The silicon bonding technology is generally combined with surface silicon machining and bulk silicon machining in MEMS.
在MEMS器件的设计与加工过程中，键合技术是体硅工艺的一项关键技术。
In the design and fabrication of MEMS devices, MEMS fabrication process based on Silicon is a main technology, to which is deeply paid attention by researchers and industries.
以此为基础阐述了建立平面多体机械系统键合图模型的一般方法及其动力学原理。
Based on this, the generic procedure of modeling planar multibody mechanical systems by bond graphs and its dynamic principle are described.
这些实验现象和分析结果为后期的键合参数匹配规律和系统动态特性研究打下基础。
These experiment phenomena and analysis results are useful to the research of parameters match and dynamic feature of system in the future.
根据超声引线键合实验平台电路结构，设计了PZT(压电陶瓷)驱动信号采集电路。
According to the circuit of ultrasonic wire bonding experiment platform, a piezoelectric transducer (PZT) driver signal acquisition circuit was designed.
介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料，包括金丝、铜丝和铝丝。
Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.
介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料，包括金丝、铜丝和铝丝。
Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.
应用推荐