介绍硬盘磁头激光锡球焊接的原理和优点；
Introduces the principle of the tin-ball laser bonding on hard disk sliders and its merit.
共晶钎料BGA球焊点的抗剪强度比锡铅合金钎料自身的抗剪强度大。
The shear strength of BGA joint with eutectic solder is higher than that of tin-lead alloy itself.
目前，该算法已在全自动金丝球焊机的图像识别系统中得到实际应用。
At present, the algorithm has been applied to the image matching system of the fully automatic gold wire bonder.
伊萨是一家注重正直与工作热情的跨国性企业，始终处于全球焊接领域的前沿位置。
ESAB is an international company of integrity and passion operating at the cutting edge of global welding.
超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。
Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
从目前的研究中，它被发现，单晶铜线材可以键合金垫和铝焊盘上由无气体保护的热超声球焊和楔焊。
From the present study, it is found that single crystal copper wires can be bonded on the gold pad and the aluminum pad by thermosonic ball bonding and wedge bonding without gas protection.
工作原理是通过X-Y工作台和焊头的三维运动控制，定位并拉出设定的金丝线型，采用超声波热压球焊方法焊接芯片管脚。
By controling the three-dimensional motion of the X-Y table and bond head, precision positioning and desired line-type gold wires can be realized, and an ultrasonic wave bonded method is used.
工作原理是通过X-Y工作台和焊头的三维运动控制，定位并拉出设定的金丝线型，采用超声波热压球焊方法焊接芯片管脚。
By controling three-dimensional motion of the X-Y table and bond head, precision positioning and desired line-type gold wires can be realized, and an ultrasonic wave bonded method is used.
工作原理是通过X-Y工作台和焊头的三维运动控制，定位并拉出设定的金丝线型，采用超声波热压球焊方法焊接芯片管脚。
By controling three-dimensional motion of the X-Y table and bond head, precision positioning and desired line-type gold wires can be realized, and an ultrasonic wave bonded method is used.
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