穿孔金属晶片载体也用于晶片键合，用以容易地处理以及松解。

A perforated metal wafer carrier is also used for wafer bonding for easy handling and de-bonding.

youdao

穿孔金属晶片载体也用于晶片键合，用以容易地处理以及松解。

A perforated metal wafer carrier is also used for wafer bonding for easy handling and de-bonding.

youdao