自动冲切成形系统是半导体集成电路封装引线框架后的加工专用系统。
The automatic cutting system is a special equipment for processing the lead frames of semiconductor ICs after encapsulation.
自动冲切成形系统是半导体集成电路封装引线框架后的加工专用系统。
The automatic cutting system is a special equipment for processing the lead frames of semiconductor ICs after encapsulation.
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