传统的前向拱丝越来越难以满足目前封装的高密度要求,反向拱丝能满足非常低的弧高的要求。
Traditional forward looping technology is becoming hard to meet high-density requirements of IC Packaging, and reverse looping can comparatively achieve very low loop height.
传统的前向拱丝越来越难以满足目前封装的高密度要求,反向拱丝能满足非常低的弧高的要求。
Traditional forward looping technology is becoming hard to meet high-density requirements of IC Packaging, and reverse looping can comparatively achieve very low loop height.
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