用正常语序改写下列倒装句。
倒装的功能包括强调、承上启下和结构均衡。
The function of inversion includes emphasis, structural balance, connecting link between the preceding and the following.
广泛的可用的工具，包括作物，倒装，浅灰色。
A wide range of tools available, including Crop, Flip, Shallow, Gray and Filter.
倒装正常词序的变化，例如，倒装动词置于主语之前。
A change in normal word order, such as the placement of a verb before its subject.
现代汉语中的倒装句是只存在于会话话语的句法现象。
Inverted sentences in modern Chinese are syntactic phenomena found exclusively in the conversational discourse.
通过新的防倒装置的研制和应用，取得了很好的效果。
Through developing new tilting preventing device, good result is gained.
本次设计阐述了冲压倒装复合模的结构设计以及工作过程。
The design describes the structure of compound die stamping flip-chip design and working process.
本论文主要对倒装句的使用及翻译方法进行了说明和举例。
In this paper, mainly the use of inversion and translation methods are described and exemplified.
集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
无论在什么情况下都不可哄骗或强迫孩子吃东西。这是倒装句。
设计了一种立式储罐倒装施工用自动跟踪式横焊缝自动焊装置。
A kind of automatic welding equipment with the tracking system for horizontal welding line in inverted construction of vertical storage tank is developed.
文章拟从结构差异和表达效果两方面对英汉倒装句进行对比研究。
The article tries to study Chinese and English inversions from the structural differences and effects of expression.
通过对芯片进行背面减薄和倒装连接，可以实现有源芯片的埋嵌。
The embedded active chip also can be realized by backside thinning and flip chip bonding.
这些计算分析和经验对大型储罐的倒装法施工有很大的借鉴意义。
The calculating analysis and experience on large storage upside-down construction can be used for reference.
论文以大量的实例以及合理的分析试图穷尽研究倒装的衔接功能。
The thesis makes a tentative attempt to exhaust the research on the functions of cohesion of anastrophe with a wide range of supportive examples and appropriate analyses.
通过在底圈壁板上口铺设环形平台，可方便地进行储罐的倒装施工。
By means of annulus platform located above the bottom ring wall, the tank inverted construction can be implemented expediently.
介绍了导链式倒装法安装大型钢制立式储罐的原理及制作工艺流程。
Principles for chain upside -down mounting of big steel vertical big storage tanks and technological process of manufacturing are introduced.
沈阳到处都有那种倒装的三轮车。我想要一个，可以在淘宝上买到吗？
Backwards bikes are everywhere in Shenyang. I want one. Can you get one on Taobao?
倒装芯片的应用对出光效率的提高特别是散热处理达到了较好的效果。
Flipchip's applying is good for improvement of efficiency of light emitting of LED and especially for thermal management.
液压提升倒装法是一种先进的多管式烟囱钢内筒安装方法，属国内首创。
Hydraulic lifting upside-down method is advanced for the internal steel stacks' installation, and it was firstly invented inland.
当表示否定意义的副词或相当于副词的词语置于句首时，句中主谓需倒装。
With a negative adverb or adverb equivalent in front position, inversion of subject and verb must occur.
板上倒装芯片(FCOB)作为一种微电子封装结构形式得到了广泛的应用。
Flip Chip on Board (FCOB) has been used widely as a microelectronics packaging structural form.
同时，以一翻边精度要求较高的零件为例，介绍了一种倒装式结构的翻边模。
Meanwhile, as a part needs high precision as flanging for example, flanging die with hyperbatic structure is described.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
更有意思的是饲养员同熊猫“交谈”的方式。（倒装表强调，按原有语序翻译）
More interesting is the way the feeder "talks" to the panda.
本论文研究了MCM中芯片安装互连、芯片倒装焊接及其关键支撑技术等内容。
This paper talks about the major supporting technologies for MCM package: the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding.
介绍拱顶油罐的充气顶升倒装之施工方法，对充气所需风量、风压进行了分析。
The article introduces the inverting way of assembling an oil tank by air jacking, and analyzes the pressure and air flow needed by air jack system.
采用了MWD无线随钻仪器，倒装钻具组合，优化了钻井参数，实现了精确中靶。
MWD tools were used, and by using of reversed BHA and optimizing of drilling parameters, precise target hitting was achieved.
论述了如csp、BGA及倒装芯片等先进封装技术在微电子工业中所发挥的重要作用。
And the important role of advanced packagings such as CSP, BGA and Flip-chip technology in the microelectronics is described as well.
实验结果表明，这种改进的倒装焊技术可以使HEMT 器件的饱和漏极电流提高10%。
Thedrain saturation current is increased 10% after bonding. To disperse heat of GaNHEMT, this flip chip bonding method seems to be simple and effective.
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