The package comprises a substrate, an adhesive layer, a chip and a wire, wherein the chip is bonded to the substrate through the adhesive layer and connected to the substrate through the wire.
该封装件包括基板、粘附层、芯片和导线，芯片通过粘附层键合到基板，并通过所述导线连接到基板。
The package comprises a substrate, an adhesive layer, a chip and a wire, wherein the chip is bonded to the substrate through the adhesive layer and connected to the substrate through the wire.
该封装件包括基板、粘附层、芯片和导线，芯片通过粘附层键合到基板，并通过所述导线连接到基板。
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