The wire sawing process has been applied to slice single silicon into thin wafers for its character of minimum warp, uniform thickness and low kerf loss.
由于线锯切割具有切片薄、表面翘曲变形小、厚薄均匀和切口损失小等优点，被广泛用于单晶硅切片加工。
Including: Sawing, punching, turning, drilling, tapping, milling, polishing, wire-drawing, CNC processing, bending, forming and other deep processing, argon arc welding and assembly.
包括：锯切、冲压、车削、钻孔攻丝、铣、焊接、抛光、拉丝、数控加工、弯曲、成型等深加工、氩弧焊接、装配。
The preparation of sawing wire base and the sawing wire plating process are introduced.
研制了一种新型环形电镀金刚石线锯，介绍了锯丝基体的制备及锯丝电镀工艺。
A kind of neotype plating diamond ring wire saw has been researched and manufactured. The preparation of sawing wire base and the sawing wire plating process are introduced.
研制了一种新型环形电镀金刚石线锯，介绍了锯丝基体的制备及锯丝电镀工艺。
The assembly of MOSFET is consisted of five main processes, which are wafer sawing, die attach, wire bond, molding, trim and form.
MOSFET的封装主要由晶圆切割，晶粒黏贴，焊线，封塑，切割成型这五大流程组成。
The results show that the temperature in the sawing arc with a diamond wire increases with vibration.
随绳锯转速和进给速度增大，锯切弧区的温度呈上升趋势；
The results show that the temperature in the sawing arc with a diamond wire increases with vibration.
随绳锯转速和进给速度增大，锯切弧区的温度呈上升趋势；
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