If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.
在芯片测试中，若引线焊盘上的铝层被探针扎穿，就会影响引线键合的牢固性和器件的可靠性。
There are so many process parameters affecting bond quality in wire bonding and these parameters are directly related to the reliability of semiconductor device.
引线键合过程中的工艺参数较多，他们直接影响键合质量的好坏，影响半导体器件的可靠性。
Statistical process control (SPC) technique is used to improve quality and reliability of microelectronic products, and monitor production conditions of wire bonding process.
采用统计过程控制(SPC)技术，提高微电路产品的质量和可靠性，监控键合工序的生产过程状态。
This study is intended to evaluate the bondability and reliability of single crystal copper wire bonding.
本研究的目的是评估单晶铜引线接合的接合性和可靠性。
It is difficult to guarantee the quality by earlier checking, so the wire bonding is one of the key factors affecting the SAW filter's performance and reliability.
由于内连质量很难通过中间过程的检测完全确定，因此，内连技术成为影响SAW器件性能和可靠性的关键之一。
It is difficult to guarantee the quality by earlier checking, so the wire bonding is one of the key factors affecting the SAW filter's performance and reliability.
由于内连质量很难通过中间过程的检测完全确定，因此，内连技术成为影响SAW器件性能和可靠性的关键之一。
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