Hundreds of systems are in use in wafer processing applications throughout the world.
成千上百种系统广泛应用于全球晶片工艺过程。
The drilling machine for large glass wafer processing is a production machine for silicon pressure sensors.
大片玻璃打孔机是一台硅压力传感器的生产设备。
To provide a method and apparatus for heating fluid in the proximity head of a semiconductor wafer processing system.
提供了一种用于加热接近头中的流体的设备和方法。
Semiconductor wafer processing. Single or dual chamber, 25-wafer batch processing offers high-performance wafer cleaning, rinsing and drying.
半导体晶片处理。单或双室，25晶圆批量处理提供高晶片清洁，冲洗和脱水功能。
The wafer processing system is an important subsystem of the lithography, which consists of a wafer transmission system and a wafer pre-alignment system.
晶圆处理系统是光刻机的重要组成子系统，其包含两个主要部分：晶圆传输系统和晶圆预对准系统。
A common distribution core that provides all electrical power, gases, chemicals, and other services to the sectors of an automated wafer processing system.
一种公共分配中心，向自动化晶片处理系统中的各个部分提供所有的电源、气体、化学原料和其它服务。
With its mature patented wafer processing techniques, Shanghai Hua Hong NEC is able to help its customers achieve lower prototyping costs and shorter time-to-market.
多年积累的生产专利工艺还可进一步协助客户降低前期制作费用，满足客户对产品进入市场的时间以及价格的要求。
The chemical is widely used in the production of LSI, VLSI and other semiconductors to remove photoresist edge bead that occurs during typical spin coat wafer processing.
该试剂用于清除匀胶后残留于硅片边缘及背面的光刻胶，已经广泛应用于中、大规模集成电路及其它半导体器件的生产。
The quality requirements on si wafer for modern ULSI, research progress on CZ si crystal growth technology and wafer processing, the market situation and prospect were outlined.
概述了现代特大规模集成电路对硅单晶片的质量要求、直拉硅单晶生长工艺及晶片加工技术研究进展和硅单晶材料市场现状及发展趋势。
The wafer plasma processing chamber is configured to react the reactive radical with a species at a surface of a wafer disposed in the wafer plasma processing chamber.
晶片等离子体加工室的结构设置成使反应性自由基与放置在晶片等离子体加工室内的晶片表面上的物质反应。
The WLP technology that initiates processing from Wafer-Level and finishes in chip scale will be applicable on a daily broadening scale in plane array FCP.
在圆片规模上开始加工，结束于芯片规模的圆片级封装技术将在面型阵列倒装芯片的封装中得到日益广泛的应用。
Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet.
半导体晶圆背面加工方法，衬底背面加工方法，和辐射固化型压敏粘着片。
Computer chip: or chip; integrated circuit or small wafer of semiconductor material embedded with integrated circuitry, comprises the processing and memory units of the modern digital computer.
芯片：集成电路或嵌入集成电路的小而薄的半导体，包含现代数字计算机的处理和记忆装置。
The defects of quartz wafer were recognized by means of image processing, and the quartz wafer was sorted by its quality.
利用图像处理的方法识别石英晶体片缺陷，进而按照品质实现自动分选。
The print circuit wafer uses the vanguard technology and the equipment production with the processing glass cloth, has the fine electric insulation performance and workability.
印制电路板用处理玻璃布采用先进技术与装备生产，具有优良的电绝缘性能和加工性能。
The effect of rapid thermal processing (RTP) on oxygen precipitates profile and denude zone (DZ) in Czochralski (CZ) silicon wafer during simulating CMOS processing is investigated.
本文研究了快速热处理工艺(RTP)在模拟的CMOS热处理工艺中对直拉硅单晶中氧沉淀和洁净区(DZ)的影响。
SRB was verified on three different scale semiconductor wafer fabrication facilities simulation models by applying various dispatching rules on non-batch processing machines.
基于三种不同规模的半导体生产线模型，在非批加工设备使用不同的调度规则的情况下，对提出的SRB进行了仿真验证。
RJM resistor MELF Resistors also can be called a wafer resistance, cylindrical-type resistance, non-pin resistance, or non-lead resistance, mainly used for surface mount processing.
又可称为晶圆电阻、圆柱型电阻、无引脚电阻、或无引线电阻，主要用于表面贴装加工过程。
The invention provides a semiconductor wafer, a semiconductor chip and a method and an apparatus for processing the wafer.
本发明提供了半导体晶片、半导体芯片及处理晶片的方法和设备。
The processing tool is used for processing wafer;
制程工具用以处理晶 圆；
The processing tool is used for processing wafer;
制程工具用以处理晶 圆；
应用推荐