This makes electroforming the preferred technique for high-density applications such as wafer bumping, where aperture counts are now more than 2 million.
这使电铸成为高密度应用，比如晶片封装优选技术。
This makes electroforming the preferred technique for high-density applications such as wafer bumping, where aperture counts are now more than 2 million.
这使电铸成为高密度应用，比如晶片封装优选技术。
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